• 中文
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  • 车载解决方案
  • Safety
  • articles
  • ADAS
  • Automated-Driving
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  • 环保信息
  • articles
  • Pump Control (for Water, Oil and Fuel)
  • HEVs, PHEVs, EVs and Inverters
  • DC-DC Converters for HEVs, PHEVs and EVs
  • Battery Monitoring System (BMS)
  • Start-Stop Systems
  • Brake Control (ABS/ESC)
  • Electronic Suspension Control
  • Electric parking brake (EPB), precrash seat belt tensioners
  • Electronic Power Steering (EPS) System
  • Gasoline Engine System
  • Direct Injection
  • Transmission Control
  • AEC-Qualified Automotive Discrete Devices
  • Photocoupler for Automotive Applications
  • 冷却风扇
  • Air-Conditioning (HVAC) - Compressors
  • Air-Conditioning (HVAC) - Dampers
  • LED Headlights
  • 安全气囊
  • Body Control Module (BCM)
  • In-Vehicle Networks
  • Automotive Analog Power Device (TB9111FTG Half-Bridge MCP)
  • Automotive Three-Phase Brushless DC Motor Driver ICs
  • Functional Safety
  • Automotive Brushed DC Motor Driver ICs
  • Automotive Stepping Motor Driver ICs Evaluation Boards (for Motor Control)
  • System Power Supply ICs for Automotive
  • Automotive Intelligent Power Devices (IPDs)
  • Automotive Microcontrollers
  • Automotive Discrete Devices
  • 信息
  • articles
  • Dual/Single-Picture Video Processors
  • Video Decoder ICs
  • Automotive Peripheral Bridge ICs
  • Automotive Ethernet Bridge ICs
  • In-Vehicle Audio Power Amplifier ICs
  • Speech Middleware (Voice Trigger)
  • Target Applications of Automotive Communication ICs
  • Automotive Hard Disk Drives
  • Information and Entertainment Applications
  • 车载通信RF-IC
  • 可靠性信息
  • 应用说明
  • TXZ4系列
  • TX00系列
  • TXZ3系列
  • TX03系列
  • TX04系列
  • TLCS-870/C1系列
  • About download.
  • Application Notes / Sample Programs Download
  • 在线学习
  • Microcontroller Function Terms
  • ΔΣ AD Converters
  • Serial Interface
  • Seven serial interfaces of Toshiba MCU
  • Flash ROM
  • Control using MCU
  • Servo Control
  • Vector Engine and Vector control
  • Ultrasonic Motor Control Technology: High Resolution Control by MCU
  • USB interface
  • Inverter control
  • Microcontroller Simulators
  • Real Time Clock (RTC)
  • Watch Dog Timer (WDT)
  • Operation of Watchdog Timer
  • Synchronous Serial Port (SSP)
  • SPI Format
  • Clock Frequency
  • SSI Format
  • Microwire Format
  • Analog / Digital Converter (ADC)
  • AD Conversion
  • Input / Output Port (PIO)
  • Ports of Built-in Peripheral Functions
  • Allotment Propriety Confirmation of Built-in Peripheral Functions
  • Flow of Port Signals
  • How to Set Ports
  • Port E
  • Port F
  • Port L
  • Port K
  • Port M
  • Description Order of Register Setting for Ports
  • Port B
  • Port C
  • Port D
  • Port G
  • Port H
  • Port I
  • Port N
  • Port J
  • Clock / Interrupt
  • Operation of Low Power Consumption Mode
  • Operation and Stop of each Function
  • Execution Order of Exception Processing
  • Interrupt Permission / Forbidden Setting, and Interrupt Priority Setting
  • 16-bit Timer
  • Clock Cycle
  • Timer Interrupt (interval timer mode)
  • PPG Output (IGBT Mode)
  • Serial Channel (SIO / UART)
  • SIO Baud Rate
  • UART Baud Rate
  • SIO Output
  • UART Output
  • Serial Bus Interface (SBI)
  • SIO Serial Clock Frequency
  • SIO Output
  • I2C Output Clock Frequency
  • I2C Output
  • Multi-Purpose Timer (MPT)
  • Function Descriptions (PMD Mode)
  • Function Descriptions (IGBT Mode)
  • Source Clock (Timer Mode)
  • PPG Output (IGBT Mode)
  • 3-Phase Motor Control (PMD Mode)
  • Discrete Semiconductor Device
  • Chapter I : Basis of Semiconductors : p-type Semiconductor
  • Chapter I : Basis of Semiconductors : What is a Compound Semiconductor?
  • Chapter I : Basis of Semiconductors : What is a pn Junction?
  • Chapter I : Basis of Semiconductors : Types of Semiconductor Devices
  • Chapter I : Basis of Semiconductors : What is a Semiconductor?
  • Chapter I : Basis of Semiconductors : Semiconductor Materials
  • Chapter I : Basis of Semiconductors : n-type Semiconductor
  • Chapter II : Diodes : Types of Diodes
  • Chapter II : Diodes : Characteristics Application of Various Diodes
  • Chapter II : Diodes : Schottky Barrier Diodes (SBDs)
  • Chapter II : Diodes : Functions of Rectifier Diodes
  • Chapter II : Diodes : Reverse Recovery Characteristic of Schottky Barrier Diodes (SBDs)
  • Chapter II : Diodes : TVS diode (ESD protection diode)
  • Chapter II : Diodes : Difference Depending on Metal of Schottky Barrier Diodes (SBDs)
  • Chapter II : Diodes : Forward Characteristic of Rectifier Diodes (IF-VF Characteristic)
  • Chapter II : Diodes : Difference between TVS Diodes and Zener Diodes (2)
  • Chapter II : Diodes : Variable-capacitance Diodes (Varicap Diodes)
  • Chapter II : Diodes : Difference between TVS Diodes and Zener Diodes (1)
  • Chapter II : Diodes : FRDs (Fast Recovery Diodes)
  • Chapter II : Diodes : Voltage Regulator Diodes (Zener Diodes)
  • Chapter III : Transistors : Types of Transistors
  • Chapter III : Transistors : Performance of MOSFETs: Characteristic of Capacitance
  • Chapter III : Transistors : Performance of MOSFETs: Safe Operating Area(or Area of Safe Operation)
  • Chapter III : Transistors : Bipolar Transistors (BJTs)
  • Chapter III : Transistors : Bias Resistor Built-in Transistors (BRTs)
  • Chapter III : Transistors : Junction Field-Effect Transistors (JFETs)
  • Chapter III : Transistors : Application of IGBTs
  • Chapter III : Transistors : Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs)
  • Chapter III : Transistors : Differences between BJT and MOSFET
  • Chapter III : Transistors : Structure and Operation of MOSFET
  • Chapter III : Transistors : MOSFET Performance Improvement: Decision Factors of RDS(ON)
  • Chapter III : Transistors : MOSFET Performance Improvement: Approach to Low RDS(ON)
  • Chapter III : Transistors : MOSFET Performance Improvement: Super-Junction MOSFETs (SJ-MOS)
  • Chapter III : Transistors : Summary of MOSFET Features by Structure
  • Chapter III : Transistors : Performance of MOSFETs: Drain Current and Power Dissipation
  • Chapter III : Transistors : Performance of MOSFETs: Avalanche Capability
  • Chapter III : Transistors : Comparison of Forward Characteristics of IGBTs and MOSFETs
  • Chapter III : Transistors : Insulated-Gate Bipolar Transistors (IGBTs)
  • Chapter III : Transistors : Operation of Insulated-Gate Bipolar Transistors (IGBTs)
  • Chapter III : Transistors : Performance Improvement of IGBTs:Evolution of Vertical Design
  • Chapter III : Transistors : What are RC-IGBTs and IEGTs?
  • Chapter III : Transistors : Comparison of Transistors by Structure
  • Chapter III : Transistors : Datasheets of MOSFET: Maximum Ratings
  • Chapter III : Transistors : Datasheets of MOSFET: Electrical Characteristics
  • Chapter III : Transistors : Datasheets of MOSFET: Capacitance and Switching Characteristics
  • Chapter III : Transistors : Datasheets of MOSFET: Body Diode
  • Chapter IV : Local Power Supply ICs : Operation of Switching Regulators
  • Chapter IV : Local Power Supply ICs : Why POL Supply ICs Are Wanted?
  • Chapter IV : Local Power Supply ICs : Functions of LDO
  • Chapter IV : Local Power Supply ICs : Types of Local Power Supply ICs
  • Chapter IV : Local Power Supply ICs : Load Switch IC
  • Chapter IV : Local Power Supply ICs : Functions of Load Switch IC
  • Chapter IV : Local Power Supply ICs : Power Management IC
  • Chapter IV : Local Power Supply ICs : Operation of Linear Regulators
  • Chapter IV : Local Power Supply ICs : Example of Power Line Structure in a System
  • Chapter V : Optical Semiconductors : Types of Optical Semiconductors
  • Chapter V : Optical Semiconductors : Characteristics of Photocouplers(Current Transfer Ratio: CTR)
  • Chapter V : Optical Semiconductors : Principal Characteristics of Photocouplers(Trigger LED Current)
  • Chapter V : Optical Semiconductors :Aging Variation Data of Photocouplers
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler
  • Chapter V : Optical Semiconductors : Types of Photocouplers
  • Chapter V : Optical Semiconductors : Types of Photocouplers (Internal Structure)
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler “Output-Side Resistor”
  • Chapter V : Optical Semiconductors : Types of Photocouplers (Packages)
  • Chapter V : Optical Semiconductors : The wavelength range of LEDs
  • Chapter V : Optical Semiconductors : Safety Standards of Photocouplers
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler “Input Current”
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler Check
  • Chapter V : Optical Semiconductors : How to Use a Photocoupler “Output Current”
  • Chapter V : Optical Semiconductors : What Is a Photocoupler?
  • Chapter V : Optical Semiconductors : Why Are Photocouplers Necessary?
  • Chapter V : Optical Semiconductors : Light-Emitting Principal of LEDs
  • 难题解决案例
  • 案例1.【低耐压MOSFET U-MOS Ⅸ-H系列】
  • 案例2.【40V系列容限不足，通过45V系列解决问题】
  • 案例3.【中高电压MOSFET DTMOSⅣ系列】
  • 案例4.【通过模拟分析解决EMI噪音问题】
  • 案例5.【IGBT／MOSFET驱动用光耦TLP5214】
  • 案例6.【光伏输出光耦TLP3906】
  • Example of Toshiba’s Solution for a Customer’s Problem
  • 综合目录
  • 目录
  • 假冒商品警告
  • 专题
  • 功率MOSFET访谈
  • 电机解决方案访谈
  • 智能功率器件（IPD）
  • Motor Drivers
  • 微控制器
  • 型号命名规则
  • Bipolar Transistors
  • Microcomputer
  • IGBT/IEGT
  • Diodes
  • 通用线性IC
  • MOSFET / 结型场效应管
  • 通用逻辑IC
  • Optical Semiconductor Devices
  • 高频器件
  • 常问问题（FAQ）
  • 二极管
  • 绝对最大额定值
  • 对于采用小封装的小信号器件，为何原因未规定结到外壳（或通道到外壳）的热阻？
  • 对于温度是否有什么特殊考虑？
  • 齐纳二极管的温度系数是否有什么特殊考虑？
  • 使用开关二极管有什么特殊考虑？
  • 电气特性表中的术语定义
  • SBD是否具有反向恢复特性（trr）?
  • 齐纳二极管的使用目的是什么？
  • How can I calculate the junction-to-ambient thermal resistance, Rth(j-a), of a small-signal diode?
  • 如何区分阳极和阴极端？
  • 如何使用齐纳二极管创造相对恒定的电压，不会受到温度和电源电压变化的显著影响？
  • 二极管的工作原理是什么？
  • 快速恢复二极管（FRD）用于什么样的应用？
  • 齐纳二极管用于什么样的电路中？
  • 将多个同一器件型号的二极管进行并联是否可行？
  • 并联多个齐纳二极管是否可行？
  • 串联多个齐纳二极管是否可行？
  • 齐纳二极管能否采用与典型二极管同样的方式进行使用？
  • 什么是二极管？
  • 什么是肖特基二极管（SBD）？
  • 齐纳电压的特性是什么？
  • varicap二极管的主要特性是什么？
  • 如果trr太大会发生什么？
  • 什么是FRD？
  • 什么是HED？
  • 什么是开关二极管?
  • 什么是变容二极管（varicap二极管）？
  • 什么是齐纳二极管?
  • 整流二极管和一般开关二极管有什么不同？
  • SBD的正向电压（VF）是什么？
  • 齐纳二极管的阻抗是指什么？
  • 使用FRD时的工作频率是多少？
  • 什么是trr?
  • FRD的trr是什么级别？
  • SBD具有什么样的特性？
  • 二极管类型有几种？
  • Why is no operating temperature range specified?
  • 通用线性IC
  • How does a boost converter work?
  • How does a buck converter work?
  • In what parts are power supply ICs used?
  • What kinds of local power supply ICs exist?
  • What kinds of switching-type local power supply ICs (switching regulators) exist?
  • Optical Semiconductor Devices
  • What is a photocoupler?
  • Why is a photocoupler necessary?
  • What types of photocouplers are available?
  • What is the internal structure of a photocoupler?
  • How many volts can be applied to the input side LED?
  • Is it possible to use a photocoupler in such a way that for items such as the LED current, output current, and output voltage, the value specified for the absolute maximum rating is exceeded for a short time?
  • What are the parameters specific to photocoupler and photorelay optical isolation devices, transfer ratio (CTR), trigger LED current, and threshold input current?
  • How are the current transfer ratio (CTR), trigger LED current, and threshold input current measured?
  • For a photocoupler and photorelay incorporating a LED device, in designing equipment, which should be considered: LED life or photodetector life?
  • A photocoupler is an isolation device. What is dielectric strength, which indicates its insulation capability?
  • What is the difference between a photocoupler and a photorelay?
  • What are the safety standards required for photocouplers?
  • What are required by safety standards applicable to photocouplers? How are they specified in products?
  • How can I find safety standard authentication information about photocouplers?
  • What is the current transfer ratio?
  • What is the CTR classification by rank?
  • Why are there two current transfer ratios: CTR and CTR (Saturation)?
  • What is the difference between a dark current and OFF-state collector current?
  • Why is VECO very low (0.3V) for Darlington transistors such as TLP187 and TLP387? What precautions should be taken when using such transistors?
  • In designing a circuit using a transistor coupler, how should the current transfer ratio be reflected?
  • How should a circuit driving the LED of a transistor coupler be selected?
  • In a circuit using a transistor coupler, how should load resistance be selected?
  • How many volts are minimally required for transistor couplers to operate?
  • How many milliamps are minimally required for transistor couplers to operate?
  • Up to what frequency can transistor couplers transmit signals?
  • For a transistor coupler with the base terminal, if not using the base terminal, is it OK to keep the base terminal open and do nothing?
  • For IC couplers, there is a requirement related to common-mode transient immunity. However, for transistor couplers, such a requirement does not exist. Why?
  • What is the threshold input current?
  • In designing a circuit using an IC coupler, how should the threshold input current be reflected?
  • How should a circuit driving the LED at the input side of an IC coupler be selected?
  • In a circuit using a high-speed IC coupler, how should output pull-up resistance be selected?
  • For example, for 1Mbps-type IC couplers such as TLP109 and TLP759 to operate, how many volts are minimally required?
  • For IC couplers, some products are defined with a threshold input current, and others are defined with a current transfer ratio. What is the difference between them?
  • Is a bypass capacitor required between the VCC and GND terminals?
  • How should a frequency for signals that can be transmitted by a high-speed IC coupler be estimated?
  • What is the UVLO function?
  • Is there any problem with waveforms with input signals rising or falling gently?
  • What is the difference between the open collector output type and the totempole output type? Also, what precautions should be taken for use?
  • What is the voltage range in which IC couplers can operate?
  • What is common-mode transient immunity? Why is this required for IC couplers?
  • How can I find the resistance values when the photorelay is OFF and when it is ON?
  • Up to what level of voltage can be used at the switch section of a photorelay?
  • How much input current should be passed for switch operation?
  • Up to what level of current can be used at the switch section of a photorelay? Also, for a pulsed current or AC current, what happens?
  • For signals to be switched, up to what frequency can be used?
  • How long does it take from when an input signal enters until the switch changes?
  • Can photorelays be used by series connections or parallel connections? If yes, what points require attention?
  • What is the CR product of the photorelay?
  • Can photorelays be replaced with and used in the same way as mechanical relays? What is the difference, if any?
  • What are Form A contacts and Form B contacts in a photorelay? Also, what are A, B, and C connections? What is the difference?
  • For what purposes are triac couplers used?
  • What precautions should be taken when replacing mechanical relays with triac couplers?
  • What are the differences among triac couplers, SSR (solid state relays), and photorelays?
  • What is the difference between zero-cross triac couplers and non-zero-cross triac couplers? How should they be used properly?
  • What precautions should be taken when performing phase control with triac couplers?
  • For triac couplers, how should a VDRM (400V, 600V, 800V) be selected?
  • How much input current should be set for turning the triac ON/OFF?
  • What precautions should be taken when using triac couplers for a long time?
  • How should values be selected for the constants for the snubber circuit connected to the triac?
  • When using a triac coupler to drive the main triac, how should the current limiting resistor RT directly connected to the triac be determined?
  • Can high-frequency signals be switched ON/OFF with a triac coupler?
  • When controlling a load with a triac coupler, can a load be controlled even if using a rectangular wave power supply at the load side instead of a sinusoidal wave (AC) power supply?
  • What are fiber couplers (TOSLINK?) used for?
  • What are the characteristics of optical transmission?
  • What is a fiber coupler (TOSLINK™)?
  • What is optical fiber?
  • What is optical transmission?
  • What types of optical connectors are available?
  • MOSFETs / Bipolar Transistors
  • A dotted line in a safe operating area is annotated as “This area is limited by RDS(ON).” What does it mean?
  • Aren't there maximum guaranteed values for capacitance, gate charge (Qg) and switching characteristics?
  • Are there any reasons why forward transfer admittance,
  • Are there any special considerations for using MOSFETs?
  • Electrical characteristics of MOSFETs (Static Characteristics IGSS/IDSS/V(BR)DSS/V(BR)DXS)
  • Electrical characteristics of MOSFETs (Body diode IDR/IDRP/VDSF/trr/Qrr/dv/dt)
  • Electrical characteristics of MOSFETs (Charge Characteristic Qg/Qgs1/Qgd/QSW/QOSS)
  • Electrical characteristics of MOSFETs (Dynamic Characteristics Ciss/Crss/Coss)
  • Electrical characteristics of MOSFETs (Dynamic Characteristics　tr/ton/tf/toff)
  • Electrical characteristics of MOSFETs (Static Characteristics RDS(ON))
  • Electrical characteristics of MOSFETs (Static Characteristics Vth)
  • How can I calculate the channel-to-ambient thermal resistance, Rth(ch-a), of a small-signal MOSFET?
  • How does the series gate resistor affect the MOSFET?
  • How do N-channel MOSFETs work?
  • How much gate-source voltage should be applied to drive the MOSFET?
  • I heard that MOSFETs have a diode between drain and source. What kind of diode is it?
  • Why are two MOSFETs used in series in the Lithium-ion secondary battery protection circuit?
  • Is it OK to use the body diode (parasitic diode) between the drain and source for a particular purpose?
  • Is it possible to use the Zener diode between the gate and source for surge absorption?
  • Is the MOSFET drive current necessary?
  • Is the on-state resistance of a MOSFET dependent on temperature?
  • MOS is sensitive to static electricity. How do you protect MOSFETs from static electricity?
  • How to select a suitable high voltage MOSFET for the application that current flows in the body diode. (e.g. Bridge circuit)
  • How to calculate the avalanche energy.
  • Resistors are often inserted between a CPU and MOSFETs. Why are these resistors necessary?
  • The MOSFET does not turn off by a turn-off signal. How do I solve this problem?
  • What are super junction MOSFETs (SJ-MOSs)?
  • What are the capacitance characteristics of MOSFET.
  • What are the considerations when using MOSFETs in parallel?
  • What attention should be paid when the reverse voltage is applied between drain and source of power MOSFET?
  • What attention should be paid to rising and falling time of the driving signal for MOSFET?
  • What does derating of Safe Operating Area (SOA) mean?
  • What does the dv/dt of the MOSFET mean?
  • What is avalanche capability?
  • What is the avalanche capability specified as part of the absolute maximum ratings?
  • What is the definition of "drain current (DC) (Silicon limit)" listed in the Absolute Maximum Ratings table?
  • What is the definition of power dissipation?
  • What is the meaning of “Logic-Level Gate Drive” for the MOSFET?
  • What should I pay attention to when mounting a MOSFET?
  • When using a MOSFET as a load switch, how do I reduce the inrush current that occurs?
  • Where can I find information about the MOSFET naming conventions?
  • Why do Toshiba's power MOSFETs exhibit larger gate-source leakage current, IGSS, than those of other companies?
  • Why is no operating temperature range specified?
  • 所有半导体器件
  • 半导体器件的允许耗散功率是多少?
  • 如何将功耗波近似为方波？
  • 如何计算选择半导体器件的散热片（1）
  • 如何计算选择半导体器件的散热片（2）
  • 规格书中未包括“热阻”值的半导体器件的结点温度计算方法
  • 半导体器件功率耗散时结点温度的计算方法
  • 如何计算规格书中未包括的短脉冲宽度下的瞬态热阻抗
  • 如果封装相同，热阻是否相同?
  • 在电路板设计中，降低结点温度的方法有哪些?
  • 外壳温度或引线温度是否与结点温度相同?
  • 双面散热封装的效果是什么?
  • 热通孔的效果是什么?
  • 使用散热片时重要的考虑因素是什么?
  • Rth（j-c），Rth（j-a）和Rth（ch-c）的热阻后缀是什么意思？
  • 什么是辐射等效电路?
  • 什么是热阻?
  • 什么是瞬态热阻抗?
  • 当多个半导体器件布置在同一块板上时，是否需要考虑热干扰？
  • General-Purpose Logic ICs
  • 高频器件
  • Are there any special considerations for using RF devices?
  • How can I distinguish between the cathode and anode terminals?
  • What is an RF MMIC (RF cell pack)?
  • What is an RF MOSFET?
  • What is an RF Schottky barrier diode?
  • What is an RF switching diode?
  • What is a PIN diode?
  • What is a variable-capacitance diode?
  • What is important when selecting a variable-capacitance diode?
  • What is "rs" shown in the Electrical Characteristics table?
  • 高频器件
  • Microcomputer
  • Are there any products that allow memory to be connected without using an external address decoder ?
  • Are there any products that support an extended operating temperature range ?
  • Are there any products with a built-in CAN controller ?
  • What is the meaning of LSB in representation of AD conversion errors ?
  • How do I submit ROM data ?
  • Does Toshiba provide Flash programming service ?
  • Are there any products with a built-in CAN controller ?
  • Are there any products with a built-in LCD driver ?
  • What is the meaning of LSB in representation of AD conversion errors ?
  • How do I connect a microcontroller with 16-bit data bus and a NOR Flash memory with 16-bit data bus ?
  • How do I identify whether a malfunction is caused by hardware or software ?
  • Although operation checks with test tools in the development environment were successful, proper operation cannot be achieved with the actual device.
  • It looks as if the argument is not passed to the function properly.
  • It looks as if the function call returns an unintended value.
  • What is a wide-band-gap semiconductor?
  • What is surge current?
  • What is the temperature characteristic of the SiC-Schottky barrier diode (SBD)?
  • What is thermal runaway * of the SiC Schottky barrier diode (SBD)?
  • Why does the SiC Schottky barrier diode (SBD) have a high withstand voltage?
  • 电源线和接地线是否需要去耦电容？
  • 如何计算电流和功率消耗？
  • 如何购买样品和评估板？
  • 每个卷带式包装有多少个部件？
  • 能否将电容器与输出线相连？
  • 能否在漏极（D）和源极（S）之间使用等效二极管结构？
  • MOS设备通常对静电放电（ESD）比较敏感。应该如何保护 MOSFET不受ESD的影响？
  • 请解释准许功率消耗的含义
  • 请介绍推荐的连接盘图形
  • 绝对最大额定值和推荐工作条件之间的差异是什么？
  • 允许功率消耗”的定义是什么？
  • 若静电释放到电机驱动器逻辑电路，则会产生什么影响? 芯片是否有任何保护装置？
  • 电源线和接地线是否需要去耦电容？
  • 如何计算电流和功率消耗？
  • 如何购买样品和评估板？
  • 每个卷带式包装有多少个部件？
  • 能否将电容器与输出线相连？
  • 能否在漏极（D）和源极（S）之间使用等效二极管结构？
  • 使用无传感器直流电机时的重要事项有哪些？
  • MOS设备通常对静电放电（ESD）比较敏感。应该如何保护 MOSFET不受ESD的影响？
  • 请解释准许功率消耗的含义
  • 请介绍推荐的连接盘图形
  • 移相（超前角）控制的优点是什么？
  • 绝对最大额定值和推荐工作条件之间的差异是什么？
  • 什么会造成电机故障和正弦波性失真？
  • “允许功率消耗”的定义是什么？
  • 正弦波形驱动器ICs支持的最大转速是多少？
  • 若静电释放到电机驱动器逻辑电路，则会产生什么影响? 芯片是否有任何保护装置？
  • Are decoupling capacitors required across power and ground lines?
  • How can I calculate current and power consumption?
  • How can I program the output current?
  • How many parts are supplied per tape-and-reel?
  • How many watts does the REXT resistor need to be rated at?
  • How should the power and input signals be sequenced at power-up and power-down?
  • I want to connect multiple LED drivers in cascade. Is it okay if the SCK waveform becomes shallow?
  • What are the differences between the absolute maximum ratings and the recommended operating conditions?
  • What is the definition of “allowable power dissipation”?
  • You have announced that the TB62705CFG and TB62725BFG 8-channel LED drivers will be discontinued. Do you have any replacements for these devices?
  • You have announced that the TB62706BFG and TB62726AFG 16-channel LED drivers will be discontinued. Do you have any replacements for these devices?
  • What is a high-side switch?
  • What is a low-side switch?
  • What is a short to ground?
  • What is a short to power?
  • What is the difference between IPD and IPS?
  • What does the diagnostic function available with low-voltage IPDs do?
  • What is the open-load detection function available with low-voltage IPDs?
  • What is active clamping available with low-voltage IPDs?
  • How does a low-voltage IPD sense temperature for thermal shutdown?
  • How does the thermal shutdown of a low-voltage IPD work for device protection?
  • How does the overcurrent protection of a low-voltage IPD work?
  • Are low-voltage IPDs with a high-side and a low-side switch distinguished with part numbers?
  • Are decoupling capacitors required across power and ground lines?
  • Do stepping motor drivers incorporate body diodes to absorb back-EMF?
  • How can I calculate current and power consumption?
  • How can I purchase samples and evaluation boards?
  • How many parts are supplied per tape-and-reel?
  • Is it OK to connect capacitors to the output lines?
  • Is it OK to make deliberate use of the equivalent diode structure between the drain (D) and the source (S)?
  • MOS devices are typically sensitive to electrostatic discharge (ESD). How should I protect MOSFETs against ESD?
  • Please explain permissible power dissipation.
  • Tell me about the recommended land pattern.
  • What are the differences between the absolute maximum ratings and the recommended operating conditions?
  • What is the definition of “allowable power dissipation”?
  • What would happen if static electricity were discharged to the motor driver logic? Isn’t any protection implemented on-chip?
  • Are the collector and emitter terminals of a bipolar transistor interchangeable?
  • Are there any special considerations for heat dissipation from bipolar transistors?
  • Electrical characteristics of bipolar transistors
  • Example of measurement of the key bipolar transistor characteristics
  • How can I calculate the junction-to-ambient thermal resistance, Rth(j-a), of a small-signal transistor?
  • How does an ambient temperature rise affect the transistor breakdown voltage?
  • How do npn and pnp transistors operate?
  • Reading individual technical datasheets for bipolar transistors
  • Datasheets and other documents for bipolar transistors contain a safe operating area (SOA) graph. What is it?
  • Transient thermal resistance vs. safe operating area (SOA)
  • What is the difference between small-signal transistors and power transistors?
  • What are the applications of bipolar transistors (bipolar junction transistors: BJTs)?
  • What is the relationship between the base-emitter and collector-emitter voltages of a bipolar transistor?
  • What types of bipolar transistors (bipolar junction transistors: BJTs) are available?
  • What occurs if voltage exceeding the absolute maximum rated emitter-base voltage is applied to the base terminal?
  • A junction FET is widely used for impedance conversion. What is it for?
  • Are there any reasons why junction-to-case (or channel-to-case) thermal resistance is not specified for small-package devices?
  • Are there any special considerations for thermal calculation?
  • What drives transistors: current or voltage
  • I heard that a junction FET could be used as a constant-current source. How can I create a constant-current source?
  • Is it OK to use a transistor as diodes?
  • Neither Rth(ch-a) nor Rth(j-a) is specified for MOSFETs, IGBTs and bipolar transistors. Why is that?
  • Technical documents for MOSFETs and bipolar transistors contain a safe operating area (SOA) graph. What is it?
  • What is a bias resistor built-in transistor?
  • What is a bipolar transistor?
  • What is a JFET?
  • What is a MOSFET?
  • What is a multi-chip discrete device?
  • What is an IGBT?
  • What kinds of tape packing does Toshiba offer for transistors?
  • What types of transistors are available?
  • Why is no operating temperature range specified?
  • What is an IPD?
  • What is an SOI?
  • How can I distinguish high-voltage IPDs for sine-wave and square-wave drive based on part numbers?
  • What are the applications of high-voltage IPDs?
  • How does a high-voltage IPD detect temperature for thermal shutdown?
  • What is the bootstrap circuit in high-voltage IPDs?
  • What is the level-shift driver in high-voltage IPDs?
  • What type of Hall-effect devices is suitable for use with a high-voltage IPD?
  • Does the E-Pad (metal frame) exposed on the surface of a high-side IPD have the same potential as GND?
  • Is it possible to use the E-Pad (metal frame) exposed on the surface of a high-voltage IPD as a conductive pin?
  • Metals are exposed on the sides of the SSOP30 package for high-voltage IPDs. What voltage potential do they have?
  • How are local power supply ICs used?
  • What kinds of linear-type local power supply ICs (linear regulators) exist?
  • Do linear-type local power supply ICs (linear regulators) need external parts?
  • About absolute maximum ratings (Understanding datasheet values)
  • About electrical characteristics (Understanding datasheet values)
  • Is it possible to use LDO regulators at low supply voltage? What is the minimum voltage required for their proper operation?
  • How can a low-noise power supply be created using an LDO regulator?
  • What is the resistance of the pulldown resistor connected to the CONTROL pin of the LDO regulator?
  • How does overcurrent protection work in an LDO regulator?
  • When the operating mode of the load-side IC is changed, the output voltage of an LDO regulator drops, causing the IC to malfunction. What can I do to prevent a malfunction?
  • What is the thermal shutdown (TSD) that is available with LDO regulators?
  • Are there any LDO regulators with adjustable output voltage available (requiring external resistors)?
  • What type of capacitor is suitable for use with an LDO regulator?
  • What is the quiescent current of an LDO?
  • Which characteristics in a datasheet should I refer to in order to determine whether a given LDO maintains a regulated output voltage even when input voltage varies?
  • The output voltage of an LDO drops when I increase the output current even though it is operating within the rated conditions. What type of LDO should I choose to avoid such a problem?
  • A small noise is superimposed on the output voltage of an LDO. What can I do to reduce the noise?
  • What voltage is required at the CONTROL terminal to enable an LDO?
  • Why does the LDO output voltage oscillate?
  • How can I quickly bring the output voltage of a circuit with an LDO to zero in order to set a power supply sequence for the load IC?
  • Why is the output of an LDO disabled when its input voltage decreases?
  • How can I prevent the output voltage from overshooting following the application of the control voltage to an LDO?
  • Large inrush current flows when an LDO is enabled. What can I do to prevent this?
  • Is the power-on sequence of the input voltage (VIN) and the control voltage (VCT) of an LDO significant?
  • What is the purpose of the capacitor connected to one of the external resistors for an adjustable-output LDO?
  • Is it OK to reverse-bias an LDO, causing its output voltage to become higher than the input voltage?
  • How can I calculate the junction temperature of an LDO?
  • What is an output discharge function of the load switch IC?
  • What is the input-tolerant function?
  • Is it OK to apply the input voltage following the application of an “on” signal to the CONTROL terminal?
  • How can I suppress inrush current with a load switch IC?
  • What is the value of the pull-down resistor connected to the active-High CONTROL terminal of load switch ICs?
  • Does the overvoltage lockout of the load switch IC recover automatically?
  • Does the undervoltage lockout function of the load switch IC provide a hysteresis?
  • What is the FLAG output function of the load switch IC?
  • What is the hold time of a load switch IC?
  • What are the Auto Selection and Manual Selection modes?
  • What is a break-before-make circuit?
  • What is reverse-current blocking using external back-to-back MOSFETs?
  • What is the difference between true reverse-current blocking and reverse-current blocking?
  • How does a load switch IC operate if overcurrent protection is tripped?
  • How can I calculate the power dissipation and junction temperature of a load switch IC?
  • What is a bus switch?
  • Tell me about the handling of the input of bus switches and analog switches.
  • Are the output states of flip-flops, registers, counters and one-shot multi-vibrators determinate?
  • Is it OK to leave the bidirectional pin of a bidirectional bus buffer open when it is floating?
  • Is it possible to apply a signal with a low slew rate to a Schmitt-trigger input type?
  • The output of a CMOS logic IC does not stabilize in the High or Low state. What could be the cause of this?
  • The output voltage from a CMOS logic IC alternates between High and Low for a certain period of time. That is, the output goes into oscillation. What can I do to prevent this?
  • The output voltage from a buffer type does not reach the supply voltage. What can I do to prevent this?
  • The output waveform of a CMOS logic IC has transients that look like spikes. What can I do to prevent this?
  • The input pin of a CMOS logic IC connected to High or Low has noise. What could be the cause of this?
  • What are the differences between the series?
  • What are the differences between "absolute maximum ratings" and "recommended operating conditions"?
  • Tell me about the input tolerant function.
  • Tell me about the output tolerant function.
  • In what sequence should I turn on and off the power and input signals?
  • Is a decoupling capacitor required between Vcc and GND?
  • Is it OK to leave the unused inputs of general-purpose CMOS logic ICs open?
  • Tell me about the function of bus-hold.
  • Is it OK to leave unused outputs of general-purpose CMOS logic ICs open?
  • Are there any guidelines for inputs with a slowly rising or falling edge?
  • Is it OK to connect a capacitor to an output?
  • Is it OK to short-circuit the outputs of multiple general-purpose CMOS logic ICs?
  • If multiple outputs from a general-purpose CMOS logic IC come into conflict, is the IC adversely affected?
  • The datasheets for some logic ICs do not show the maximum operating frequency. What is their maximum operating frequency?
  • How many amperes of current can an output pin drive?
  • How can I calculate fan-out?
  • How can I calculate the operating supply current and power dissipation?
  • What kinds of faults could occur if an electrostatic discharge is introduced into a general-purpose CMOS logic IC? How can the faults be prevented?
  • Tell me about thermal design.
  • Tell me about the devices suitable for use as level shifters.
  • What options do I have to perform level shifting from 5 V to 3.3 V and vice versa?
  • What options do I have to perform level shifting from 1.8 V to 2.5 V and vice versa?
  • Are there level shifters compatible with communication standards?
  • What is the difference between a level-shifting bus switch type and a bus buffer type?
  • Tell me about the power-up sequence and signal input timing for dual-supply level shifters?
  • Do bidirectional bus buffers have any constraints on the timing of the direction (DIR) and other input signals?
  • Is it necessary to add an external pullup resistor between the input or output pin of a level-shifting bus switch and the power supply (VCCA or VCCB)?
  • What is the maximum operating frequency of level shifters?
  • What is an IGBT?
  • What is the difference between MOSFETs and IGBTs?
  • For what applications should MOSFETs and IGBTs be used?
  • What is the principle of operation of the IGBT?
  • In what structures are IGBTs available?
  • What is a reverse-conducting IGBT (RC-IGBT)?
  • What is conductivity modulation?
  • What is a safe operating area?
  • What is the definition of IGBT power dissipation?
  • What is the tail current of an IGBT?
  • Please give some application examples for IGBTs.
  • Please explain hard switching and soft switching using IGBTs.
  • Please explain the operation of voltage-resonant soft switching of an IGBT.
  • Please explain the operation of current-resonant soft switching of the IGBT.
  • How can I provide protection against the surge voltage generated by the turn-off of an IGBT?
  • Is it possible to connect multiple IGBTs in parallel? If so, is there anything to note about parallel connection?
  • At what voltage should the IGBT gate be driven?
  • 除了硅，还有什么其它类型的半导体?
  • 如果绝对最大额定值条件只出现瞬间，半导体器件能否承受？
  • 什么是“半导体”？
  • 关于化合物半导体
  • 如果P型半导体接触N型半导体会发生什么?
  • 何谓N型半导体?
  • 何谓P型半导体?
  • Where can I find information on tape specifications and packing quantities per reel?
  • linear_opamp
  • What are open-loop and closed-loop gains of an op-amp?
  • For what applications are op-amps used?
  • Why is feedback used in op-amps?
  • What is an operational amplifier?
  • What types of amplifier circuits can be configured using an op-amp?
  • What types of op-amps are available?
  • What is the maximum frequency at which an op-amp can be used?
  • What is the purpose of using a differential amplifier? (Common-mode rejection ratio: CMRR)
  • What is the ideal op-amp?
  • What is the virtual short of an op-amp?
  • What is the input offset voltage of an op-amp?
  • Is it necessary to connect bypass capacitors to the power supply terminal of an op-amp?
  • Is there any way to amplify a signal with a voltage close to the GND level?
  • What types of noise affect an op-amp?
  • When the supply voltage is low, what can I do to increase the dynamic range of an op-amp?
  • long-term-supply-of-semiconductor-products
  • MOSFET
  • 12V-300V MOSFET
  • DSOP Advance，热增强的双面散热封装，提高了大电流应用的电源效率
  • U-MOSⅨ-H系列是提高开关电源效率的理想MOSFET
  • 产品种类丰富，从超小封装到通用封装应有尽有
  • 采用最新工艺的P通道MOSFET系列
  • U-MOSⅨ-H系列大幅提高了代表损耗的品质因数
  • 通过缓冲电路降低开关噪声（低尖峰技术）
  • 东芝MOSFET是低电压驱动设备的理想选择
  • 车载MOSFET
  • 车载MOSFET的工艺趋势
  • N通道U-MOS系列产品的开关特性
  • 车载MOSFET的封装趋势
  • 车载应用推动小型MOSFET设备的小型化
  • 400V-900V MOSFET
  • 先进的超结MOSFET DTMOSVI产品
  • 新型TO-247-4L封装600-V超结功率MOSFET（DTMOSIV-H系列）的商业化
  • 先进的双扩散MOSFET（D-MOS）π-MOSIX系列产品
  • 小型低导通电阻MOSFET
  • 低导通电阻
  • 应用
  • 小封装系列产品
  • 大功率器件
  • IEGT（PPI）
  • 压接式封装
  • 工作原理
  • SiC模块
  • 塑料外壳模块IEGT（PMI）
  • 混合SiC-SBD模块
  • 光半导体器件
  • 高速通信光耦
  • 兼容3.3V电源，功耗低
  • 支持从20kbps到50Mbps传输速度丰富的产品系列
  • 可接收／源逻辑输入信号的兼容产品
  • 栅极驱动IC光耦
  • 过电流保护功能（VCE(sat)检测）和内置有源米勒钳位功能
  • 兼容于全摆幅输出
  • 支持UVLO功能
  • IPM接口的光耦
  • 响应更高速
  • 更高共模瞬态抗扰度（CMTI）
  • 支持高电平有效和低电平有效IPM
  • 隔离放大器和隔离式ΔΣAD调制器
  • 实现输入模拟信号的高精度隔离信号传输
  • 有助于降低功耗和稳定初级电源设计
  • 采用薄封装有助于减少安装空间
  • 光继电器（MOSFET输出）
  • 什么是光继电器？
  • 采用东芝最新一代U-MOS的光继电器
  • 小型S-VSON4封装
  • 高电流（大容量）光继电器
  • UL 508认证
  • 应用于无线通信设备的IC
  • 应用于Bluetooth®无线通信的IC
  • Bluetooth SIG技术发起者未来的发展方向
  • 医疗保健
  • 信标／标签
  • 东芝Bluetooth®产品的特点
  • 支持NFC的IC（CLF）
  • 智能功率IC
  • 三相无刷直流电机驱动IC，内置功率器件
  • 通过内置MOSFET的多芯片模块提高效率和电流
  • 采用新高击穿电压SOI工艺降低损耗
  • 采用与高压兼容的小型贴片式封装减小安装面积
  • 车载驱动IC
  • 高边和低边开关产品
  • 栅极驱动IC产品
  • 各种车载应用的优质驱动IC
  • 通用逻辑IC
  • 具有电平转换功能的新系列产品：7UL1Gxx／7UL1Txx
  • 采用1010封装的超小型单门CMOS逻辑IC
  • 双极晶体管／IGBT
  • 二极管
  • SiC肖特基二极管
  • 适用于电源电路的碳化硅器件
  • 改进JBS结构以降低泄漏电流和提高浪涌电流能力
  • 低开关损耗SiC肖特基二极管（SBD）
  • SiC SBD的高耐压（反压）特性
  • TVS二极管（ESD保护二极管）
  • ESD耐受性
  • ESD脉冲吸收性能（第1峰值电压降低）
  • 丰富的封装产品阵容：开发较小封装
  • 低动态电阻
  • 丰富的封装产品阵容：多位封装
  • 确保信号质量：插入功率损耗
  • 射频器件
  • 电机驱动IC
  • 无刷直流电机驱动IC
  • 有刷直流电机驱动IC
  • 步进电机驱动IC
  • PSpice® 模型下载页面
  • 微控制器
  • 基于Arm® Cortex-M0的微控制器
  • TX00系列
  • M030组
  • M060组
  • 基于Arm® Cortex-M4架构的微控制器
  • TX04系列
  • M440组
  • M460组
  • M470组
  • TXZ4系列
  • M4G组（1）
  • M4K组
  • M4L Group 1
  • 不推荐用于新产品设计／宣布停产的产品
  • TX19A系列
  • TLCS-900系列
  • TLCS-900/H系列
  • TLCS-900/L系列
  • TLCS-900/L1系列
  • TLCS-870/C系列
  • TLCS-870/X系列
  • 基于Arm® Cortex-M3架构的微控制器
  • TX03系列
  • M320组
  • M330组
  • M340组
  • M350组
  • M360组
  • M370组
  • M380组
  • M310组
  • TXZ3系列
  • M3H组（2）
  • M3H组（1）
  • 功能
  • JTAG（边界扫描）
  • 多功能定时器（MPT）
  • CAN（控制器区域网络）
  • OFD（振荡频率检测器）
  • 高分辨率PPG输出
  • PSC（可编程伺服器／程序控制器）
  • 遥控信号处理器（RMC）
  • USB (通用串行总线)
  • 矢量引擎
  • CEC（消费电子控制）
  • EtherMAC（以太网媒体访问控制）
  • I2S（Inter-IC Sound）
  • 32位微控制器
  • TX09系列
  • TX19A/H1系列
  • TLCS-900/H1系列
  • 振荡器制造商信息
  • 基于Cortex-A架构的微控制器
  • 8位微控制器
  • TLCS-870/C1系列
  • 传感器
  • 线性图像传感器
  • 移动外围设备的接口转换IC
  • 显示接口转换IC
  • 摄像接口转换IC
  • HDMI®接口转换IC
  • I/O扩展IC
  • 电源管理IC
  • 低压差稳压器（LDO稳压器）
  • 高纹波抑制比降噪
  • 快速负载瞬态响应性能
  • 通过低压差电压降低功耗
  • 低静态电流
  • 丰富的封装系列
  • 各种附加功能
  • 负载开关IC
  • 过电流保护功能
  • 过电压保护功能
  • 浪涌电流降低电路
  • 热关断
  • 丰富的封装系列产品
  • 低输入电压运行／低导通电阻特性
  • 低电流消耗特性
  • 面积小，功能性强
  • PFC控制IC
  • LED驱动IC
  • 电子熔断器（eFuse IC）
  • 高精度过电压钳位功能
  • IEC 62368-1安全标准认证
  • 抑制浪涌电流的功能
  • 只需通过一个封装实现所有的主要保护功能
  • 快速短路保护
  • 高精度过电流保护
  • 热关断功能和恢复工作
  • 反向电流阻断功能
  • 线性IC
  • 运算放大器和比较器
  • 有助于设备长期运行的低电流运算放大器
  • 可以放大和处理低电压、宽范围的输入信号
  • 用于传感器小信号放大的低噪声运算放大器
  • 丰富的封装系列产品
  • 晶体管阵列
  • 晶体管阵列：新老产品对应表
  • 晶体管阵列：新产品功能列表
  • 晶体管阵列：新产品的主要特点
  • 功率放大器IC
  • 汽车音响用4通道高效线性功率放大器：TCB701FNG
  • 具有最高45W输出的汽车音响用4通道高效线性功率放大器：TCB702FNG
  • 具有强大抗电涌能力的汽车音响功率放大器：TCB503HQ
  • 具有内置专用偏移检测功能的汽车音响用电流反馈4通道功率放大器：TCB502HQ
  • 采用全新CD-0.13工艺的45-W级4通道功率放大器IC：TCB001HQ
  • 具有内置专用偏移检测功能的汽车音响用电流反馈4通道功率放大器：TCB501HQ
  • 支持来自车辆的外部音频输出，允许在HEV和EV中使用电动汽车报警音响系统：TB2909FNG
  • 车载器件
  • 车载微控制器
  • 电机控制技术
  • 车载开发工具和合作伙伴
  • 功能安全技术
  • 车载微控制器产品阵容
  • 车载微控制器产品阵容：电动助力转向（EPS）应用的PMD微控制器：TMPM350FDTFG（量产）
  • 车载微控制器产品阵容：HEV和EV应用的M/G微控制器: TMPR454F10TFG（量产）
  • 车载微控制器产品阵容：通用车载电池监测应用和微控制器: TMPM358FDTFG（量产）
  • 车载微控制器产品阵容：电动助力转向（EPS）应用的PMD微控制器：TMPM351F10TFG（量产）
  • 车载微控制器产品阵容：HEV和EV应用的M/G微控制器：TMPM354F10TAFG（量产）
  • 车载接口转换IC
  • 车载外围桥接IC
  • TC9560系列
  • TC9562系列
  • 双／单画面视频处理器
  • TC90195AXBG
  • TC90175XBG【新产品】
  • 车载无刷电机驱动IC
  • 用于正弦波电流控制的3相BLDC电机预驱IC：TB9080FG
  • 3相无传感器BLDC电机预驱IC: TB9061AFNG
  • 3相无刷无传感器预驱IC TB9062FNG
  • 用于EPS应用的3相BLDC电机预驱IC：TB9081FG
  • 极低功率无线电应用的RF IC
  • 车载TVS二极管（ESD保护二极管）
  • ESD耐受性
  • 低动态电阻
  • 保证信号质量：插入功率损耗
  • 具有多种封装选择的丰富产品阵容：开发较小的封装
  • 车载步进电机驱动IC
  • 车载步进电机驱动IC：IC TB9120FTG
  • 车载有刷直流电机驱动IC
  • 1通道有刷直流电机驱动IC：TB9051FTG
  • H桥预驱IC：TB9057FG
  • 具有LIN从属功能的车载直流电机驱动IC：TB9058FNG
  • 视频解码器IC
  • 产品介绍
  • 车载系统电源
  • TB9044AFNG概述
  • TB9045FNG系列产品概述
  • 车载RF IC
  • 车载
  • 应用于车载通信服务的RF IC（ETC／DSRC）
  • 图像识别处理器Visconti™
  • 图像识别处理器Visconti™：特点
  • 图像识别处理器Visconti™：信息
  • 图像识别处理器Visconti™：路线图和系统架构
  • 图像识别处理器Visconti™：软件开发环境
  • 发布图像识别处理器，车用Visconti™4
  • 应用
  • 空调
  • articles
  • AC-DC电路（室外单元）
  • PFC电路（全开关系统）
  • 压缩机部分
  • AC-DC电路（室内单元）
  • PFC电路（部分开关系统）
  • 风扇部分（室内／室外单元）
  • 百叶部分
  • Isolation circuit (Compressor block between outdoor/indoor units)
  • 阀门控制部分
  • 清洁部分
  • 微控制器部分（室外单元的电源控制块）
  • 传感器输入部分（室内单元）
  • 传感器输入部分（室外单元）
  • Automotive ADAS
  • articles
  • DC-DC converter circuit (non-insulated buck type)
  • Audio output section
  • Power supply ON/OFF control and reverse connection protecting circuit (P-ch method)
  • CAN / FlexRay transmission section
  • Image input unit
  • Power supply ON/OFF control and reverse connection protecting circuit (N-ch method)
  • 无绳电动工具
  • articles
  • 无刷电机（集成MOSFET）电机驱动电路
  • MCU外围电路
  • 无刷电机（外部MOSFET）电机驱动电路
  • Motor drive circuit Brushed motor/ Mechanical switching
  • 电池充电电路
  • Motor drive circuit Brushed motor/ MOSFET switching
  • 智能手表
  • articles
  • 电源电路（电池方式）
  • 脉冲检测电路（光发射侧）
  • 电源电路（USB方式）
  • 显示输出电路
  • Motor control for vibrators
  • 相机输入电路
  • 脉冲检测电路（光检测侧）
  • 平板电脑设备
  • articles
  • 音频电路
  • 系统电源电路（有功率控制器的方法）
  • 触摸传感器电路（光学类型）
  • 触摸传感器电路（电容式）
  • 系统电源电路（无功率控制器的方法）
  • 相机单元电路
  • 显示电路
  • 无线电路
  • 游乐设施
  • articles
  • 图形处理电路
  • Medal processing circuit
  • 主要处理电路
  • 子处理电路
  • 可编程逻辑控制器
  • articles
  • 采用全定制ASIC的MCU模块电路
  • 电源模块
  • 采用MCU和FFSA™的MCU模块电路
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  • 数字输出模块电路
  • 智能插头
  • articles
  • 使用光继电器的交流开关（低于0.3A）
  • 无线／按键输入部分详情
  • 使用光伏耦合器和MOSFET的交流开关举例（电流约为0.3A~1A）
  • 使用机械式继电器的交流开关
  • 使用可控硅和可控硅输出光伏耦合器的交流开关举例（电流约为1A~）
  • 电源详情
  • Automotive IVI
  • articles
  • Wireless communications section
  • Power supply ON/OFF control and reverse connection protecting circuit (N-ch method)
  • Power supply ON/OFF control and reverse connection protecting circuit (P-ch method)
  • Video input section, Audio input section
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  • DC-DC converter circuit (non-insulated buck type)
  • 监控摄像头
  • articles
  • 电源电路／电源详情
  • 电源电路／SD卡部分详情
  • 电源电路／电源详情
  • 相机运动部分详情
  • Power supply circuit of storage
  • 多功能打印机
  • articles
  • 显示器块
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  • USB 2.0电路
  • 多功能打印机电源电路详情
  • ADF块传真调制解调器块
  • 引擎块／加热器块／修整器块
  • Electric shaver
  • articles
  • 控制MCU电源
  • 电机保护
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  • 电子血压计
  • articles
  • 电机控制
  • 控制MCU电源
  • 恒压电源电路
  • 压力传感器
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  • 浪涌电压保护
  • IoT传感器
  • articles
  • LED驱动
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  • 主要控制部分
  • 冰箱
  • articles
  • 风扇驱动电路
  • LED驱动电路
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  • 压缩机驱动电路
  • 加热器控制电路
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  • IH电饭煲
  • articles
  • LED驱动电路
  • 加热器控制电路
  • 电磁感应线圈驱动电路（使用栅极驱动耦合器）
  • 电磁感应线圈驱动电路（使用分立元件）
  • 风扇电机驱动电路
  • 操作面板部分
  • IH电磁炉
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  • LED驱动电路
  • 电流检测器
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  • 显示和操作部分
  • Wireless charger
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  • Full-bridge inverter circuit
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  • 运动相机
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  • 射频单元（GPS）
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  • 射频单元（Wi-Fi／Bluetooth）
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  • Wireless Earphone
  • articles
  • Details of earphone case / External connector
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  • Details of earphone case / Power supply lines (Load switch)
  • Details of earphone / Power supply circuit
  • Details of earphone / Battery management
  • 电动牙刷
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  • 无线电源接收单元整流电路
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  • LED驱动电路
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  • 电机控制单元（1）
  • 电池管理
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  • 通信单元
  • 主电机驱动单元（MCD（控制器）＋栅极驱动IC＋IPM）
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  • AC-DC电路
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  • 传感器输入单元
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  • 固态硬盘
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  • 信号系统
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  • LED照明
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  • PFC电路（全开关）
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  • 传感器输入电路
  • 微波炉
  • articles
  • LED驱动电路
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  • IGBT驱动电路
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  • 操作面板
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  • 主电机驱动单元（当使用无刷电机时）
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  • 运行单元（以键／LED为例）
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  • 家用光伏逆变器
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  • 升压转换器电路
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  • Battery Management System for Automotive
  • articles
  • Charge circuit (Ground fault detection)
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  • Passive cell voltage regulation (Use of battery management IC)
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  • Charge circuit (Detection of mechanical relay sticking)
  • Battery monitoring circuit
  • Adding redundancy to communications
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  • Automotive Electric Water Pump
  • articles
  • Brush motor drive circuit
  • Brushless motor drive circuit
  • Power supply ON/OFF control and reverse connection protecting circuit (P-ch method)
  • Power supply ON/OFF control and reverse connection protecting circuit (N-ch method)
  • Brushless motor drive circuit
  • Automotive Power Sliding Door
  • articles
  • Brush motor drive circuit (1)
  • Brushless motor drive circuit
  • Power supply ON/OFF control and reverse connection protecting circuit (P-ch method)
  • Power supply ON/OFF control and reverse connection protecting circuit (N-ch method)
  • Brush motor drive circuit (2)
  • 不间断电源
  • articles
  • 显示器块保护电路
  • DCDC–MCU DC信号传输线路
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  • 模拟信号传输线路
  • USB block Protection circuit
  • 电源DC-DC转换器（电源）
  • 运动分析（电池充电器）
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  • 运动分析（电源）
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  • 血糖仪
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  • 控制MCU电源
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  • 相机模块
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  • LCD背光（中／低驱动电压）
  • 相机运动解决方案
  • 人体成分分析仪
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  • 压电元件
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  • 外围接口
  • 用于12V系统的AC-DC转换器（交错式PFC）（1.6kW电源（Vinac＝90~264V，Vout＝12.0V，Iout＝66.7A／133A））
  • 用于12V系统的AC-DC转换器（无桥PFC）（1.6kW电源（Vinac＝90~264V，Vout＝12.0V，Iout＝66.7A／133A））
  • 用于48V系统的DC-DC转换器（1.2V和100A输出绝缘DC-DC转换器的电源（Vindc＝40~59.5V，Vout＝1.2V，Iout＝100A））
  • 用于48V系统的DC-DC转换器（300W隔离式DC-DC转换器电源（Vindc＝36~75V，Vout＝12.0V，Iout＝25A））
  • 风扇单元
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  • 红外传感器电路
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  • 无刷电机驱动电路（IPD＋MOSFET）
  • Wi-Fi／Bluetooth电路
  • 无刷电机驱动电路（电机驱动IC）
  • 有刷电机驱动电路（电机驱动IC）
  • 智能马桶盖
  • articles
  • 加热器／水龙头控制电路
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  • 盖子和阀座开／关有刷电机驱动电路
  • 风扇电机驱动电路（有MCD）
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  • 恒温器
  • articles
  • 电源电路
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  • Automotive Engine Control
  • articles
  • Power supply ON/OFF control and reverse connection protecting circuit (N-ch method)
  • Power supply ON/OFF control and reverse connection protecting circuit (P-ch method)
  • Fuel injection system
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  • Automotive Junction Box
  • articles
  • Semiconductor relay system
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  • Inverter for HEV/PHEV/EV
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  • Inverter circuit
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  • articles
  • DC-DC converter circuit (non-isolated buck type)
  • DC-DC converter circuit (non-isolated boost type)
  • DC-DC converter circuit (isolated type)
  • Power supply ON/OFF control and reverse connection protecting circuit (N-ch method 48V)
  • Power supply ON/OFF control and reverse connection protecting circuit (N-ch method 12V)
  • Electric Power Steering
  • articles
  • Brushless motor drive circuit
  • Brush motor drive circuit
  • Power supply ON/OFF control and reverse connection protecting circuit (P-ch method)
  • Power supply ON/OFF control and reverse connection protecting circuit (N-ch method)
  • Automotive LED Headlamp
  • articles
  • LED matrix control circuit
  • Power supply ON/OFF control and reverse connection protecting circuit (P-ch method)
  • DC-DC converter circuits (non-insulated boost type)
  • Power supply ON/OFF control and reverse connection protecting circuit (N-ch method)
  • Transmission management
  • articles
  • Brushless motor drive circuit (N-ch /P-ch types)
  • Power supply ON/OFF control and reverse connection protecting circuit (P-ch method)
  • Mechanical relay system
  • Power supply ON/OFF control and reverse connection protecting circuit (N-ch method)
  • Automotive HVAC
  • articles
  • Brush motor drive circuit
  • Power supply ON/OFF control and reverse connection protecting circuit (P-ch method)
  • Power supply ON/OFF control and reverse connection protecting circuit (N-ch method)
  • Stepping motor drive circuit
  • Brushless motor drive circuit(12V power supply)
  • Brushless motor drive circuit(48V power supply)
  • 无绳清洁器
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  • LED drive circuit for lighting
  • Flyback AC-DC circuits
  • Head motor drive circuit (Brush motor)
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  • 仿真器
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  • TX19A / H1 Series Development System
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  • TX09系列开发系统　
  • 合作伙伴信息
  • IAR Systems AB
  • ESP Co., Ltd
  • Arm Ltd. (KEIL)
  • Computex Co.,Ltd.
  • Green Hills Software / Advanced Data Controls Corp.
  • iFORCOM KYOEI Co.,Ltd.
  • Sohwa & Sophia Technologies Inc.
  • DTS INSIGHT CORPORATION (formerly Yokogawa Digital Computer Corporation)
  • GRAPE SYSTEMS INC.
  • Ubiquitous AI Corporation
  • ADLINKS Corp.
  • Elnec s.r.o.
  • Andor System Support Co., Ltd.
  • SEGGER Microcontroller GmbH & Co. KG
  • ZLG (GUANGZHOU ZHIYUAN ELECTRONICS CO., LTD)
  • BITRAN CORPORATION
  • Technohands Co., Ltd.
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  • Techno Mathematical Co.,Ltd.
  • TOA ELECTRONICS, Inc. Flash Support Group Company
  • Tokyo Eletech Corporation
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  • eForce Co., Ltd.
  • KYOCERA Corporation
  • Kyoto Microcomputer Co.,Ltd.
  • HI-LO SYSTEMS RESEARCH CO.,LTD
  • GAIA System Solutions Inc.
  • GAIO TECHNOLOGY CO.,LTD.
  • Dediprog Technology Co., Ltd
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  • 深圳市贝杰特科技有限公司
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  • 封装与包装信息
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  • 1.6kW, 80Plus Platinum Class, High efficiency Server AC-DC Power supply
  • 200W AC-DC Power Supply
  • 300W Isolated DC-DC Converter
  • Bridgeless PFC Power Supply Basic Simulation Circuit
  • Application Circuits of TPD4152F Square-Wave Control Type of BLDC Motor Driver
  • Application Circuits of TPD4204F and TB634FNG Sine-Wave Control Type of BLDC Motor Driver
  • Application Circuits of TPD4206F and TB634FNG Sine-Wave Control Type of BLDC Motor Driver
  • Application Circuits of TPD4151F Square-Wave Control Type of BLDC Motor Driver
  • Flyback AC-DC Power Supply Basic Simulation Circuit
  • Flyback DC-DC Power Supply Basic Simulation Circuit
  • Application Circuit(Current sensing) and Design Guide of the TLP7920 Isolation Amplifier
  • Application Circuit(Voltage sensing) and Design Guide of the TLP7920 Isolation Amplifier
  • Application Circuit(Current sensing) and Design Guide of the TLP7820 Isolation Amplifier
  • Application Circuit(Voltage sensing) and Design Guide of the TLP7820 Isolation Amplifier
  • LDO Regulator TCR15AGADJ Application & Circuit
  • LDO Regulator TCR15AG (fixed output voltage type) Application & Circuit
  • LDO Regulator TCR3UG Series Application for Power Supply of IoT Devices
  • Load Switch IC TCK321G, TCK322G, TCK323G Application & Circuit
  • Load Switch IC TCK301G, TCK302G, TCK303 Application & Circuit
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  • 东芝将开始量产针对可穿戴应用的ApP Lite™处理器系列IC
  • 东芝Visconti™4图像识别处理器为DENSO的前置摄像头主动安全系统提供支持
  • 08
  • 东芝存储器株式会社推出采用64层3D闪存的BGA NVMe™ SSD
  • Update on Toshiba Memory Corporation’s Investment in Production Equipment for Fab 6 at Yokkaichi Operations
  • 东芝存储器株式会社推出采用64层3D闪存的客户级SATA SSD
  • 东芝存储器株式会社推出全球首款采用64层3D闪存的企业级SSD
  • Update on the Sale of Toshiba Memory Corporation
  • 09
  • 东芝面向三相无刷风扇电机推出采用小型表面贴装型封装的500V正弦波驱动器IC
  • 东芝存储器株式会社将在Kitakami（北上）市和Iwate（岩手）市筹备新工厂以扩大闪存运营
  • 东芝宣布面向移动客户端存储应用推出新的1TB硬盘驱动器
  • 东芝推出用于电源线保护的高性能、高峰值脉冲电流瞬态抑制二极管
  • 东芝宣布推出具有防失速反馈结构的步进电机驱动器IC新产品阵容
  • 东芝即将推出用于下一代无线LAN的低电压5GHz接收器
  • 东芝推出10TB企业级HDD
  • 东芝面向数字控制开关电源和IPM驱动推出具备欠压锁定功能的光电耦合器
  • 东芝推出具备业界最小尺寸的新系列高速信号传输光继电器
  • Update on the Sale of Toshiba Memory Corporation
  • Notice on the Sale of Toshiba Memory Corporation
  • 东芝面向继电器驱动器推出小型有源钳位MOSFET
  • 东芝300mA小型LDO稳压器IC结合低静态偏置电流与高波纹抑制比及快速负载瞬态响应
  • 东芝面向移动和消费应用推出采用业界领先小型封装的N沟道MOSFET驱动IC
  • Notice on the Signing of a Share Purchase Agreement with a Bain Capital-Led Consortium for the Sale of Toshiba Memory Corporation
  • 东芝将推动汽车半导体解决方案业务
  • 东芝推出可轻松切换至多极电机的新型三相无刷风扇电机控制器IC
  • 10
  • 东芝启动面向汽车应用的恒流两相步进电机驱动器样品发货
  • 东芝推出采用DPAK表面贴装型封装的第二代650V碳化硅肖特基势垒二极管
  • Toshiba Memory Corporation to Further Invest in Production Equipment for Fab 6 at Yokkaichi Operations
  • SDHC/SDXC Memory Card with embedded wireless LAN functionality FlashAir™ may have a security vulnerability related to the generation and management of WPA2 key
  • Toshiba Contributions Make Toshiba the Winner of the 2017 MIPI Corporate Award
  • 东芝推出新型表面贴装型有刷电机驱动器IC
  • 11
  • 东芝推出中压、高容量、小型封装的光继电器
  • 东芝面向移动应用推出采用业界最小封装的1.5A LDO稳压器
  • 东芝发布10TB监控型硬盘
  • 东芝存储器株式会社推出采用64层3D闪存的UFS器件
  • 东芝存储器株式会社推出2TB客户级NVMe™ SSD
  • Nexty Electronics and Toshiba Microelectronics Establish Software Development Joint Venture
  • 12
  • 东芝推出10TB NAS硬盘
  • 东芝面向汽车应用推出新款低功耗Bluetooth® IC
  • 东芝推出汽车音响用4声道高效率线性功率放大器
  • 东芝推出全球首款传统磁记录技术的14TB硬盘
  • 东芝推出符合UFS Ver.2.1标准的嵌入式NAND闪存
  • Toshiba and Western Digital Reach Global Settlement and Agree to Strengthen Flash Memory Collaboration
  • UPDATE:SDHC/SDXC Memory Card with embedded wireless LAN functionality FlashAir™ may have a security vulnerability related to the generation and management of WPA2 key
  • 东芝电子元件及存储装置株式会社为汽车音响推出采用纯MOS的功放IC
  • 东芝面向工业应用推出拥有业界最低导通电阻的100V N沟道功率MOSFET
  • Toshiba Launches New Series of Next Generation 10,500 RPM Enterprise Performance 2.5-inch HDD
  • 东芝面向工厂自动化及其他工业应用推出可以取代机械继电器的大电流光继电器
  • Toshiba Memory Corporation to Prepare New Semiconductor Fabrication Facility
  • 元旦放假通知
  • 2018
  • 01
  • 东芝推出两款符合Bluetooth® Ver.5.0标准的新IC
  • 东芝推出新一代600V平面MOSFET系列
  • 东芝电子元件及存储装置株式会社面向智能手机低噪声射频放大器推出实现低噪声系数的SOI工艺
  • 东芝电子元件及存储装置株式会社面向继电器驱动器推出小型双MOSFET
  • 02
  • 春节放假通知
  • Toshiba Memory Corporation to Make Next Investment in Fab 6 at Yokkaichi Operations
  • Default Password Vulnerability in CANVIO (STOR.E) wireless products
  • 东芝推出新的消费级2TB硬盘
  • 03
  • 东芝电子（中国）有限公司参展“electronica China 2018”
  • 东芝发布英文版的环境报告2017
  • 东芝为SO6L IC输出型光电耦合器扩展新的封装选项
  • 东芝推出搭载高效静电放电保护、用于驱动LED前照灯的小型MOSFET
  • 东芝新型三相无刷风扇电机驱动器IC具有转速控制（闭环控制）功能
  • 04
  • 东芝面向工厂自动化和其他工业应用推出采用小型4引脚SO6封装的中压光继电器
  • 东芝推出采用新型封装的车规40V N沟道功率MOSFET
  • 东芝发布全系列消费级硬盘
  • 东芝高微步步进电机驱动器IC样品出货即将启动
  • 东芝电子元件及存储装置株式会社的技术提高了远距离高像素分辨率车载激光雷达的可靠性
  • 05
  • 东芝电子元件及存储装置株式会社宣布董事及审计师更新名单
  • 东芝面向工厂自动化和其他工业应用推出光继电器
  • 东芝电子元件及存储装置株式会社和日本半导体株式会社的新技术提高了用于0.13μm模拟电源IC的N通道LDMOS的可靠性
  • 东芝推出支持1.8V低电压和1.6A大电流驱动的H桥驱动器IC
  • 东芝基于Arm® Cortex®-M内核的微控制器支持Mbed™ OS
  • 06
  • 东芝电子元件及存储装置株式会社和艾普凌科有限公司将建立混合信号IC业务的联盟
  • 东芝面向汽车信息娱乐应用推出接口转换芯片
  • 东芝电子亮相PCIM Asia 2018，为客户提供全方位系统级解决方案
  • 东芝电子元件及存储装置株式会社推出具有远程通信和低功耗特点的Bluetooth®低功耗SoC
  • 东芝宣布14TB硬盘获得超微优选存储服务器可用性认证
  • 07
  • 东芝宣布推出新的汽车应用模拟输出IC光耦
  • Toshiba Announces 14TB HDD Availability on Select Supermicro Storage Servers
  • 东芝开发出散热性能更强的低反向电流肖特基二极管
  • 东芝启动通过UL508认证的工业控制设备光继电器的出货
  • 东芝推出紧凑型功率MOSFET栅极驱动器智能功率器件
  • TDSCSA00436: CANVIO网络存储产品存在多个漏洞
  • CANVIO网络存储产品的软件更新终止
  • 东芝推出用于短距离数据传输的单向光模块适配器
  • 东芝推出专为NAS平台打造的全新MN07系列硬盘，可满足OEM和集成商要求
  • 东芝面向消费设备和工业设备推出基于Arm® Cortex®-M3且具备先进功能的低功耗微控制器
  • 东芝推出采用DIP4封装的大电流光继电器
  • 东芝开发出散热性能更强的40V N沟道功率MOSFET
  • 08
  • 东芝宣布推出新一代超结功率MOSFET
  • 东芝再次扩大SAS HDD产品容量
  • 09
  • 东芝面向汽车音响推出具备卓越抗电涌性能的功率放大器
  • 国庆放假通知
  • 东芝推出具备限流检测功能的有刷直流电机驱动器IC
  • 东芝高级Bluetooth®低功耗SoC采用紧凑式模块提供远程通信
  • 10
  • 东芝推出面向汽车应用的Bluetooth® 5 IC
  • 东芝推出最大输出功率达45W的新型汽车音响用4声道高效率线性功放
  • 11
  • 东芝推出具备高性能、低功耗和低成本结构阵列的130nm FFSA™开发平台
  • 东芝测试实验室符合国际标准，获得ISO/IEC 17025认证
  • 12
  • 东芝多款CANVIO系列移动硬盘推出全新4TB大容量
  • Toshiba adds new 12TB and 14TB helium-sealed models to both the N300 NAS and X300 Performance Hard Drive Product Line
  • 东芝推出支持1.8V低电压和4.0A大电流驱动的H桥驱动器IC
  • 元旦放假通知
  • 2019
  • 01
  • 东芝将基于Arm® Cortex®-M内核的微控制器引入中科创达生产的MCU板
  • 东芝成功研发出面向汽车驾驶员辅助系统的图像识别人工智能处理器Visconti™5的DNN硬件IP
  • 东芝发布16TB MG08系列硬盘
  • 东芝扩大用于汽车和工业应用的以太网桥接芯片产品线
  • 东芝具备LIN从属功能的车载直流电机驱动器IC样品开始发货
  • 春节放假通知
  • 02
  • 东芝将基于Arm® Cortex®-M内核的微控制器引入中科创达生产的MCU板
  • 东芝汽车级图像识别芯片集成深度神经网络加速器
  • 东芝推出支持低压运行的单电源单门逻辑IC
  • 东芝电子元件及存储装置株式会社发布了英文版的2018年环境报告
  • 03
  • 东芝推出全新小型表面贴装LDO稳压器系列
  • 东芝推出车载直流无刷电机无传感器预驱动器IC
  • 东芝新半导体公司将强化提出解决方案的能力并提高研发效率
  • 东芝推出基于Arm® Cortex®-M4的新款微控制器，内置定时器和通信通道，可实现高速数据处理
  • 东芝员工获得2018年MIPI终身成就奖
  • 04
  • 东芝推出正弦波驱动型三相无刷电机控制器IC
  • 东芝新算法大大提高了汽车激光雷达的角分辨率
  • 05
  • 东芝推出缩影镜头类型的5340像素×3行线性图像传感器面向办公室自动化和工业设备领域的应用
  • 稳定系统LSI业务的措施
  • 东芝开始为工控设备提供UL 508认证的光继电器
  • 有关东芝停止与华为合作的报道
  • 东芝推出低功耗有刷直流电机驱动器IC采用兼容引脚分配HSOP8封装
  • 06
  • 东芝推出全新低压驱动光继电器系列 --采用微型封装的光继电器支持测试设备应用的高密度装配--
  • 搭载东芝高级图像识别处理器的丰田Alphard／Vellfire荣获日本预防安全性能最高奖项
  • 东芝的IGBT／IEGT紧凑模型实现了对能效和电磁干扰噪声的高精度预测
  • 东芝电子亮相PCIM Asia 2019，展示电力能源方面先进技术
  • 09
  • 东芝推出采用业界最小封装的低输入功耗型电压驱动光继电器
  • 东芝推出高压双通道螺线管驱动器IC
  • 东芝推出适用于3相无刷电机的600V正弦波PWM驱动器IC
  • 10
  • 东芝推出低电容TVS二极管满足Thunderbolt 3和其他高速信号线的静电保护要求
  • 东芝推出采用智能相位控制与闭环速度控制技术的新款三相无刷电机控制预驱IC
  • 东芝即将参展第二届中国国际进口博览会
  • 11
  • 逻辑LSI（先进ASIC）业务策略
  • 东芝推出首款可以重复使用的电子熔断器eFuse
  • 投标要约登记声明（投标要约人：东芝电子元件及存储装置株式会社，目标公司：NUFLARE TECHNOLOGY, INC.）
  • 采用东芝图像识别处理器的丰田雷克萨斯UX和雷克萨斯NX获得日本预防安全性能评估满分
  • 投标要约登记声明的修订（投标要约人：东芝电子元件及存储装置株式会社，目标公司：NUFLARE TECHNOLOGY, INC.）
  • 关于开始NuFlare Technology，Inc.股份的投标要约公告（证券号：6256）
  • 东芝电子元件及存储装置株式会社发布了英文版的环境报告2019
  • 科技赋能数字时代 东芝亮相第二届中国国际进口博览会
  • 12
  • 东芝推出适用于NVR和DVR平台的6TB监控硬盘
  • 东芝推出无需传感器控制采用闭环转速控制技术的新型三相无刷电机控制预驱IC
  • 东芝推出通用系统电源IC，采用多路输出保障汽车功能安全
  • （更新） 关于开始NuFlare Technology，Inc.股份的投标要约公告（证券号：6256）
  • 东芝面向电压谐振电路推出新款分立IGBT有助于降低功耗并简化设备设计
  • 由于对于NuFlare Technology，Inc.股份的投标要约延长修改“关于开始NuFlare Technology，Inc.股份的投标要约公告（证券号：6256）”的公告
  • 东芝面向车载应用推出采用紧凑型封装的100V N沟道功率MOSFET
  • 东芝电子元件及存储装置株式会社宣布更换首席执行官计划
  • 关于我公司股份代号NUFLARE TECHNOLOGY的要约结果的通知（证券号：6256）
  • 春节放假通知
  • 东芝电子元件及存储装置株式会社宣布董事变更计划
  • Toshiba Materials将开设氮化硅衬底第二生产基地（Toshiba Materials Co., Ltd.）
  • 东芝推出适用于可编程逻辑控制器的紧凑型高速通信逻辑输出光电耦合器
  • 东芝推出紧凑型低功耗、高分辨率微步步进电机驱动IC
  • 东芝集团支援抗击新型冠状病毒感染性肺炎疫情
  • 东芝推出适用于工厂自动化和工业应用的小型6引脚SOP封装大电流光继电器
  • 东芝新增新型低功耗有刷直流电机驱动IC
  • 东芝的新型100V N沟道功率MOSFET有助于降低汽车设备的功耗
  • 今日宣布研发出“ TaRF11”，这是东芝最先进的射频SOI [1]工艺（TarfSOI™），针对5G智能手机等移动设备中的射频开关和低噪声放大器（LNA）进行了优化。
  • 东芝面向中大电流IGBT／MOSFET 推出内置保护功能的光耦
  • 东芝最新企业级硬盘通过Microchip Technology’s Adaptec®主机总线适配卡和RAID适配卡兼容性测试
  • 东芝扩大微控制器产品线—推出用于物联网设备的32位微控制器TXZ+™家族—
  • 东芝推出采用其最新一代工艺的80V N沟道功率MOSFET，助力提高电源效率
  • Introducing Storage & Electronic Devices Solutions Company
  • Regarding Advertisement "Storage & Electronic Devices Solutions Company Takes Off"
  • 新产品
  • transistor
  • 用于继电器驱动器的小型有源钳位MOSFET：SSM3K357R
  • 采用小型封装、具有高允许功率耗散的100V双型N通道MOSFET产品：SSM6N815R
  • 新一代600V平面功率MOSFET π-MOSIX系列产品：TK750A60F，TK1K2A60F，TK1K9A60F，TK650A60F
  • 用于工业设备、具有业内最低导通电阻的100V N沟道功率MOSFET产品：TPH3R70APL，TPN1200APL
  • 继电器驱动用小型双MOSFET：SSM6N357R
  • 扩大有助于提高工业设备电源效率的100V N通道功率MOSFET U-MOSIX-H系列产品线：TPW3R70APL、TPH5R60APL
  • 扩大有助于提高电源效率的100V N沟道功率MOSFET U-MOSIX-H系列产品线：TK2R9E10PL等
  • 我们60V N沟道功率MOSFET U-MOSIX-H系列中有助于降低电源EMI的低峰值产品：TPH1R306P1
  • 用于汽车应用、采用SOP Advance（WF）封装的U-MOSIX-H系列40V N沟道功率MOSFET：TPHR7904PB、TPH1R104PB
  • 通过降低EMI噪声以允许更大设计灵活性的600V平面MOSFET π-MOSIX系列产品扩大阵容：TK1K0A60F，TK1K7A60F，TK2K2A60F，TK4K1A60F
  • 用于空调电源PFC，具有宽安全工作区域（SOA）的分立IGBT：GT50J123
  • 通过降低EMI噪声以允许更大设计灵活性的600V平面MOSFET π-MOSIX系列产品扩大阵容：TK430A60F，TK370A60F
  • 有助于提高电源效率的新一代超结N沟道功率MOSFET“DTMOSVI系列”扩大阵容：TK040Z65Z，TK065N65Z，TK065Z65Z，TK090N65Z，TK090Z65Z，TK090A65Z
  • 用于车载应用，采用-4.5V驱动电压，即使在电池电压跌落期间也能工作的-40V P沟道功率MOSFET：XPH3R114MC，XPH4R714MC，XPN9R614MC
  • 用于车载设备，具有低导通电阻，提供低功耗的小型MOSFET扩大阵容：SSM6J808R，SSM6K819R
  • 新一代超结N沟道功率MOSFET“DTMOSVI系列”的阵容扩展，有助于提高电源效率：TK110N65Z，TK110Z65Z，TK110A65Z，TK125V65Z，TK155A65Z，TK170V65Z，TK190A65Z，TK210V65Z
  • diode
  • 采用DPAK封装的第二代650V SiC SBD 产品：TRS2P65F等
  • 采用TO-220-2L封装的第二代SiC SBD产品的扩大阵容：TRS2E65F、TRS3E65F
  • 保护高电压线路（比如NFC天线）的TVS二极管：DF2B12M4SL、DF2B26M4SL
  • 适用于对低电压信号线进行ESD保护的TVS二极管：DF2B5SL
  • 适用于液晶背光的升压电路的小型低正向电压肖特基二极管：CLS10F40
  • 改进高速信号线路静电放电保护性能的TVS二极管：DF2B5M5SL，DF2B6M5SL，DF2S5M5SL，DF2S6M5SL
  • 具有高ESD保护能力的节能型通用整流器：CRG09A，CRG10A
  • 增加峰值脉冲电流额定值以提高移动设备浪涌保护性能的TVS二极管：DF2B5BSL
  • 可降低设备功耗的通用整流二极管的扩大阵容：CRG04A
  • 东芝采用了紧凑封装、具有高散热能力、简化热设计的30V／40V SBD产品扩大阵容：CUHS20F40，CUHS20F30，CUHS15F40，CUHS15F30，CUHS20S40，CUHS20S30，CUHS15S40，CUHS15S30
  • 增加峰值脉冲电流额定值以提高移动设备浪涌保护性能的TVS二极管产品扩大阵容：DF2B7BSL
  • 提供优良保护性能、同时在若干Gbps保持信号质量的车载应用低电容TVS二极管：DF2S5M4FS，DF2S6M4FS
  • opto
  • 200V，0.4A小型光继电器：TLP3145
  • 可取代机械继电器的用于工厂自动化和其他工业应用的大电流光继电器：TLP3543A等
  • 扩大SO6L（LF4）封装IC输出光耦的产品线：TLP2710（LF4）等
  • 采用4引脚SO6封装，用于工厂自动化和其它工业应用的60V／0.7A光继电器：TLP176AM
  • 用于工厂自动化和工业应用、支持高达1.4A的小型光继电器：TLP3122A
  • 采用紧凑式4引脚SO6封装、提高其关闭状态输出端电压至400V以允许简化设计的光继电器：TLP172GAM
  • 东芝推出了采用轻薄小巧的5引脚SO6封装，帮助缩小设备尺寸的IPM驱动光耦：TLP2304
  • 扩大SO6L和SO6L（LF4）封装IC输出光耦的产品线：TLP2719等
  • 推出用于IGBT和MOSFET栅极驱动，支持高温工作，可以安装在板的背面或高度受限位置的轻薄型光耦：TLP5751H（LF4），TLP5752H（LF4），TLP5754H（LF4）
  • linear
  • 具有业内小型封装、用于移动和消费应用的N通道MOSFET驱动器IC：TCK401G、TCK402G
  • 具有高纹波抑制比和快速负载瞬态响应特点和300mA低静态偏置电流的小型LDO稳压器IC：TCR3UG系列
  • 用于移动应用、具有业内最小封装的1.5A LDO稳压器：TCR15AG系列
  • 允许物联网设备和可穿戴设备长期稳定运行的小型贴片式封装LDO稳压器：TCR3UM系列
  • 东芝开始量产高精度微步进电机驱动IC
  • 使用模具树脂提高封装强度的紧凑型负载开关IC：TCK207AN
  • 用于实现物联网设备长期稳定运行的东芝小型贴片式封装LDO稳压器产品阵容最新推出了一款通用型封装TCR3UF系列产品
  • logic
  • 有助于降低车载设备功耗的4位电平转换器：TC7MP3125FK
  • 通过提高工作温度，通用逻辑IC的产品线得以扩展，可广泛用于各种应用
  • 车载用单电源4位电平转换器，可轻松设计电压电平转换电路：74LV4T125FK，74LV4T125FT，74LV4T126FK，74LV4T126FT
  • sensor
  • rf
  • automotive
  • 东芝开始量产高分辨率汽车面板视频处理器
  • Relationship with Wor(l)d Media Technology Corp.
  • Technical Review
  • 企业基本信息
  • 社长寄语
  • 管理组织架构
  • 业务概要
  • 海外制造公司
  • 东芝半导体（泰国）公司（TST）
  • Toshiba Information Equipment (Philippines), Inc. (TIP)
  • 子公司和关联公司
  • 全球销售网点
  • 环保活动
  • Current Status of Environmental Impact and Environmental Targets and Outcomes
  • Statement of Environmental Philosophy of Toshiba Electronic Devices & Storage Corporation Group
  • Top Management Commitment
  • Commendation
  • Environmental Report
  • Acquisition of ISO14001 Certification
  • 网站使用条款条件
  • 通过第三方网站进行在线认证（UL LLC-cUL）
  • 通过第三方网站进行在线认证（UL LLC-UL）
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