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电气特性
反向工作峰值电压,VRWM
电压低于工作峰值反向电压时,ESD保护二极管阻抗非常高。(即使施加反向工作峰值电压,也只有小于规定漏电流的电流流过。)设计师可以用这个参数作为指导,确保其高于被保护信号线的最大工作电压。
总电容,Ct
CT是在指定反向电压和频率下施加小信号时,二极管端子上的等效电容。总电容是二极管的结电容与其封装的寄生电容之和。结电容随反向电压的增加而减少。
动态电阻,RDYN
动态电阻是指ESD保护二极管随着反向电压的增加反向击穿时,VBR与VC之间VF–IF 曲线的电流斜率。下面描述的动态电阻和钳位电压表示ESD保护二极管的ESD性能。
反向击穿电压,VBR
反向击穿电压是ESD保护二极管在规定条件下(通常定义为1mA,尽管因器件而异)开始传导规定量电流时的电压。VBR最初是为齐纳二极管定义的参数。VBR定义为ESD保护二极管导通电压。
反向电流,IR
反向电流是ESD保护二极管在规定电压下反向偏置时,反向流动的漏电流。对于ESD保护二极管,IR按工作峰值反向电压(VRWM)定义。
钳位电压,VC
钳位电压是ESD保护二极管指定峰值脉冲电流条件下最大钳制电压。VC通常在多个峰值脉冲电流点测量。如第6节(图6.1)所示,峰值脉冲电流使用8/20μs波形。动态电阻和钳位电压代表ESD保护二极管的ESD性能。