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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
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热关断(TSD)功能可监测LDO稳压器的芯片温度并关闭其输出,以防由于负载短路、输出与GND短路、环境温度升高或自发热而导致芯片过度温升,进而造成芯片性能下降或损坏。
当TSD触发时,输出会关闭,从而芯片温度降低。TSD具有滞后性。当芯片温度降至TSD恢复温度时,输出将自动恢复正常工作。