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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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电机驱动IC允许损耗的含义。
容许损耗是指在环境温度Ta为25℃的条件下，结温Tj达到最大额定值150℃时的最大容许耗散功率。因此，该值会随着Ta温度的上升而变化，需要进行降额计算。
例如，下图1显示了TB67S569FTG的功耗与环境温度之间的关系。当环境温度超过25 ℃时，允许功耗会降低。这种降低是由于在较高温度下，热量散发到周围空气中的难度增加导致的。请注意，随着环境温度升高，器件的允许功耗会受到限制。
此外，将IC安装在电路板上会降低热阻，因此允许的功耗比单独使用IC时更高。
单独使用IC时的允许功耗假设没有散热器或PCB散热。当施加大电流时，IC会产生热量。如果散热不足，当温度达到热关断功能（TSD）的检测阈值时，TSD将激活，导致IC关断。如果这种情况持续存在，IC很有可能因超过绝对最大额定温度而损坏。
因此，请参考每种产品的应用说明并设计散热，确保结温不超过150 °C，并留有余量。
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