车载MOSFET的工艺趋势

东芝车载MOSFET将沟道微加工技术与低电阻封装技术相结合,比如铜连接器键合,以实现行业优秀的低导通电阻。

具有40V VDSS的P沟道MOSFET的导通电阻趋势
具有40V VDSS的N沟道MOSFET的导通电阻趋势

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