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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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车载MOSFET的工艺趋势

东芝车载MOSFET将沟道微加工技术与低电阻封装技术相结合,比如铜连接器键合,以实现行业优秀的低导通电阻。

具有40V VDSS的P沟道MOSFET的导通电阻趋势
具有40V VDSS的N沟道MOSFET的导通电阻趋势

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