丰富的封装系列产品

东芝负载开关IC包括一个输出晶体管和一个输出驱动IC电路，比传统的分立结构小得多。该封装系列主要针对1平方毫米级的超小型产品。特别是，该封装系列使得产品适用于需要节省空间的便携式设备。

unit:
WCSP4D

Package Size

W : 0.79 mm 0.031 inch
L : 0.79 mm 0.031 inch
H : 0.55 mm 0.022 inch
WCSP4C

Package Size

W : 0.9 mm 0.035 inch
L : 0.9 mm 0.035 inch
H : 0.5 mm 0.020 inch
DFN4A

Package Size

W : 1.2 mm 0.047 inch
L : 1.2 mm 0.047 inch
H : 0.38 mm 0.015 inch
SOT-25 (SMV)

Package Size

W : 2.9 mm 0.11 inch
L : 2.8 mm 0.11 inch
H : 1.1 mm 0.043 inch
WCSP6E

Package Size

W : 1.2 mm 0.047 inch
L : 0.8 mm 0.031 inch
H : 0.55 mm 0.022 inch
WCSP6C

Package Size

W : 1.5 mm 0.059 inch
L : 1.0 mm 0.039 inch
H : 0.5 mm 0.020 inch
WCSP9

Package Size

W : 1.5 mm 0.059 inch
L : 1.5 mm 0.059 inch
H : 0.54 mm 0.021 inch
WCSP16C

Package Size

W : 1.9 mm 0.075 inch
L : 1.9 mm 0.075 inch
H : 0.54 mm 0.021 inch

All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.

WCSP类型推荐用于小型和薄型移动和模块化设备。SMVs（SOT-25）也很受欢迎，它在消费类产品中易于操作。有关每个封装的产品系列，请参阅以上链接。这些封装在日本和泰国生产，质量高且稳定。

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