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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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对于光耦,封装内部的结构也会根据所需的隔离性能、封装尺寸和内部芯片尺寸等条件而相应变化。
1.单模面对面型
装有LED的框架和装有光电检测器的框架面对面(透射)并模制成型。硅树脂用作LED与光电检测器之间的光传输部分。
2.单模面对面型(带有聚酰亚胺薄膜)
为增加输入与输出之间的隔离电压,在LED与光电检测器之间插入聚酰亚胺薄膜。
3.双模面对面型
此光耦采用面对面式结构,内部为白色模制成型部分,外部为黑色模制成型部分。光传输部分的白色模具材质为具有高红外光透射率的树脂。
4.反射型
此光耦的结构为在同一平面上装有LED的框架以及装有光电检测器的框架。称为“反射式”是因为在硅树脂内部反射的LED光到达光电检测器。
①机体
②窗口
③检测器
④LED
⑤薄膜