东芝提供采用超小直插型封装（1×1mm fSV）的单门逻辑IC、高速总线开关（适用于USB 3.0，PCI Express 3.0等）及其它器件。该封装专为移动应用设计，有助于减小尺寸和厚度，实现低电压运行。
About information presented in this cross reference
The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
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