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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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安全工作区(SOA)是指使IGBT在不发生自损坏或性能下降的情况下的工作电流和电压条件。实际上,不仅需要在安全工作区内使用IGBT,而且还需对其所在区域实施温度降额。安全工作区分为正向偏置安全工作区(FBSOA)和反向偏置安全工作区(RBSOA)。正向偏置安全工作区定义了IGBT导通期间的可用电流和电压条件。反向偏置安全工作区定义了IGBT关断期间的可用电流和电压条件。
图(a)显示了一个正向偏置安全工作区的示例,由四个区域组成:(1)受集电极最大额定电流限制的区域;(2)受集电极功耗(热击穿)限制的区域;(3)受二次击穿限制的区域;及(4)受集电极-发射极最大额定电压限制的区域。应注意受二次击穿限制的区域,因为该区域会因器件设计而有所不同。
图(b)显示了一个反向偏置安全工作区的示例,由三个区域组成:(1)受集电极最大额定电流值(ICP)限制的区域;(2)受器件固有特性限制的区域;及(3)受集电极-发射极最大额定电压(VCES)限制的区域。在第二个区域中,最大电流与VCE成反比。特别是,硬开关应用应符合此SOA区的限制。