车载MOSFET的封装趋势
封装技术趋势
功率MOSFET封装技术趋势
DPAK＋、DSOP Advance(WF)、SOP Advance(WF)和TSON Advance(WF)采用铜连接器结构，实现了大约两倍于传统型号的载流能力。此外，新开发的S-TOGL™和L-TOGL™采用了Cu clip结构（无接线柱结构）和多引脚结构，这是铜连接器结构的进化，实现更大的电流，使性能的进一步提升。
我们正在扩大我们的产品线，以满足车载应用的不同需求。
小封装技术趋势
小型MOSFET提供了广泛的击穿电压和驱动电压范围，涵盖小信号到中功率类型。封装尺寸有多种选择，从1mm×1mm超级小封装到3mm×3mm，通过减少安装面积促进设备小型化。
车载MOSFET
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Through this website you are able to proceed to the website of our distributors ("Third Party Website") which is not under the control of Toshiba Corporation and its subsidiaries and affiliates (collectively "Toshiba"). The Third Party Website is made available to you as a convenience only and you agree to use the Third Party Website at your own risk. The link of the Third Party Website does not necessarily imply a recommendation or an endorsement by Toshiba of the Third Party Website. Please be aware that Toshiba is not responsible for any transaction done through the Third Party Website, and such transactions shall be subject to terms and conditions which may be provided in the Third Party Website.
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