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About information presented in this cross reference
The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
TO-220SM(W)、D2PAK+、DPAK+、DSOP Advance(WF)、SOP Advance(WF)和TSON Advance(WF)具有铜连接器结构,提供约两倍于传统产品的载流能力。我们正在扩大我们的产品系列,以满足车载应用的不同需求。
小型MOSFET提供了广泛的击穿电压和驱动电压范围,涵盖小信号到中功率类型。封装尺寸有多种选择,从1×1mm超级小封装到3×3mm,通过减少安装面积促进设备小型化。
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