- 型号搜索
- 交叉搜索
- 关键词搜索
- 参数搜索
- 库存查询与购买
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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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产品名称末尾的符号是什么？
产品名称末尾的字母表示IC封装信息。括号内的附加代码是我们的工厂控制代码，未在数据表中显示。无论是否有附加代码，数据表上都没有什么差异。
- 产品信息
TCBxxx或TB29xx：音频功率放大器IC／电源IC
- 产品版本信息和封装信息
A-C：表示改版后的产品。
H：表示HZIP封装产品。
FN：表示SOP封装产品。
Q：表示符合欧洲RoHS指令（2011/65/EU）（关于外部铅制零件不得含铅的规定）的产品。
G：表示符合欧洲RoHS指令（2011/65/EU）的产品。
- 附加代码
- Z：表示前端工艺工厂是日本半导体公司岩手工厂。
O：表示前端工艺工厂是日本半导体公司的大分工厂。
CA：表示委托日本半导体株式会社的岩手工厂负责制造产品芯片的铜板。
EL、EB：表示模压载带式封装。
相关链接
以下文档也包含相关信息。