热关断
热关断功能是一种电路，旨在防止由于环境温度显著升高而导致的劣化和故障，以及由于意外的大电流负载而导致的器件自身发热。当内部温度检测电路检测到指定温度时，过热保护电路将进行工作以控制输出晶体管的开／关。在TCK11xG系列中，在芯片结的绝对最大额定温度（Tj）下，检测温度设计为超过150℃。
我们的负载开关IC的热关断功能旨在当温度超过每个产品所指定的热关断操作检测温度时，关闭负载开关内的MOSFET，从而降低输出电压VOUT并限制输出电流IOUT。此功能可防止设备因过热而损坏。
负载开关IC内置热关断功能
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Through this website you are able to proceed to the website of our distributors ("Third Party Website") which is not under the control of Toshiba Corporation and its subsidiaries and affiliates (collectively "Toshiba"). The Third Party Website is made available to you as a convenience only and you agree to use the Third Party Website at your own risk. The link of the Third Party Website does not necessarily imply a recommendation or an endorsement by Toshiba of the Third Party Website. Please be aware that Toshiba is not responsible for any transaction done through the Third Party Website, and such transactions shall be subject to terms and conditions which may be provided in the Third Party Website.
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