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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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热关断功能是一种电路,旨在防止由于环境温度显著升高而导致的劣化和故障,以及由于意外的大电流负载而导致的器件自身发热。当内部温度检测电路检测到指定温度时,过热保护电路将进行工作以控制输出晶体管的开/关。在TCK11xG系列中,在芯片结的绝对最大额定温度(Tj)下,检测温度设计为超过150℃。
我们的负载开关IC的热关断功能旨在当温度超过每个产品所指定的热关断操作检测温度时,关闭负载开关内的MOSFET,从而降低输出电压VOUT并限制输出电流IOUT。此功能可防止设备因过热而损坏。
库存查询与购买
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