肖特基势垒二极管

肖特基势垒二极管是通过半导体与金属的结而形成的低VF二极管。东芝可提供从小信号产品到电力线产品的各种反向电压的广泛的产品线。东芝的肖特基势垒二极管为VF 和低IR类型，可帮助提高效率和节省功率。

产品线

You can narrow down the search for applicable products by selecting specifications.

IF/IF(AV)/IO (Max) (A)
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VR/VRRM (Max) (V)
Number of Circuits
Package name (Toshiba)
Results:

You can narrow down your search for applicable products by package type or number of pins.

unit:
SOD-962 (SL2)

Package Size

W : 0.62 mm 0.024 inch
L : 0.32 mm 0.013 inch
H : 0.3 mm 0.012 inch
CL2E

Package Size

W : 1.0 mm 0.039 inch
L : 0.6 mm 0.024 inch
H : 0.28 mm 0.011 inch
SOD-882 (CST2)

Package Size

W : 1.0 mm 0.039 inch
L : 0.6 mm 0.024 inch
H : 0.38 mm 0.015 inch
SOD-923

Package Size

W : 1.0 mm 0.039 inch
L : 0.6 mm 0.024 inch
H : 0.4 mm 0.016 inch
CST2B

Package Size

W : 1.2 mm 0.047 inch
L : 0.8 mm 0.031 inch
H : 0.38 mm 0.015 inch
SOD-963 (CST2C)

Package Size

W : 1.6 mm 0.063 inch
L : 0.8 mm 0.031 inch
H : 0.48 mm 0.019 inch
SOD-523 (ESC)

Package Size

W : 1.6 mm 0.063 inch
L : 0.8 mm 0.031 inch
H : 0.6 mm 0.024 inch
SOD-323 (USC)

Package Size

W : 2.5 mm 0.098 inch
L : 1.25 mm 0.049 inch
H : 0.9 mm 0.035 inch
SOD-323HE (US2H)

Package Size

W : 2.5 mm 0.098 inch
L : 1.4 mm 0.055 inch
H : 0.60 mm 0.024 inch
S-FLAT

Package Size

W : 1.6 mm 0.063 inch
L : 3.5 mm 0.14 inch
H : 0.98 mm 0.039 inch
M-FLAT

Package Size

W : 2.4 mm 0.094 inch
L : 4.7 mm 0.19 inch
H : 0.98 mm 0.039 inch
SOT-723 (VESM)

Package Size

W : 1.2 mm 0.047 inch
L : 1.2 mm 0.047 inch
H : 0.5 mm 0.020 inch
SOT-416 (SSM)

Package Size

W : 1.6 mm 0.063 inch
L : 1.6 mm 0.063 inch
H : 0.7 mm 0.028 inch
SOT-323 (USM)

Package Size

W : 2.0 mm 0.079 inch
L : 2.1 mm 0.083 inch
H : 0.9 mm 0.035 inch
SOT-23 (SOT23)

Package Size

W : 2.9 mm 0.11 inch
L : 2.4 mm 0.094 inch
H : 0.9 mm 0.035 inch
SOT-346 (S-Mini)

Package Size

W : 2.9 mm 0.11 inch
L : 2.5 mm 0.098 inch
H : 1.1 mm 0.043 inch
SOT-343 (USQ)

Package Size

W : 2.0 mm 0.079 inch
L : 2.1 mm 0.083 inch
H : 0.95 mm 0.037 inch
SOT-24 (SMQ)

Package Size

W : 2.9 mm 0.11 inch
L : 2.9 mm 0.11 inch
H : 1.1 mm 0.043 inch
SOT-553 (ESV)

Package Size

W : 1.6 mm 0.063 inch
L : 1.6 mm 0.063 inch
H : 0.55 mm 0.022 inch
SOT-353F (UFV)

Package Size

W : 2.0 mm 0.079 inch
L : 2.1 mm 0.083 inch
H : 0.7 mm 0.028 inch
SOT-363 (US6)

Package Size

W : 2.0 mm 0.079 inch
L : 2.1 mm 0.083 inch
H : 0.9 mm 0.035 inch
SOT-26 (SM6)

Package Size

W : 2.9 mm 0.11 inch
L : 2.8 mm 0.11 inch
H : 1.1 mm 0.043 inch

All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.

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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

技术文章

Diodes / Schottky Barrier Diodes

肖特基势垒二极管
肖特基势垒二极管是通过半导体与金属结形成的半导体二极管。

Diodes / Schottky Barrier Diodes

改进的结型势垒肖特基（JBS）结构可减少漏电流并提高浪涌电流能力
肖特基势垒二极管（SBD）具有反向恢复时间（trr）短、正向电压（VF）低等优点，但也存在高漏电流大等缺点。东芝推出了采用改进结构的SBD产品。

文档

名称 日期

技术专辑

应用

Multi Function Printer
Such as efficiency of motor driving, low power consumption and miniaturization are important in designing multi function printer (MFP). Toshiba provides information on a wide range of semiconductor products suitable for power sullpy units, engine (motor driving) units, scanner units, control units, etc., along with circuit configuration examples.
详细信息
喷墨打印机
Such as efficiency of motor driving, low power consumption and miniaturization are important in designing inkjet printer. Toshiba provides information on a wide range of semiconductor products suitable for power supply unit, engine (motor driving) units, scanner unit, etc., along with circuit configuration examples.
详细信息
无绳吸尘器
Such as high efficiency, low power consumption and miniaturization are important in designing cordless cleaner. Toshiba provides information on a wide range of semiconductor products suitable for power supply units, control unit, motor driving units, etc., along with circuit configuration examples.
详细信息
运动相机
Such as low power consumption and miniaturization are important in designing action camera. Toshiba provides information on a wide range of semiconductor products suitable for power supply and charge management units, RF circuit units, display unit, etc., along with circuit configuration examples.
详细信息
电子血压计
Such as low power consumption and miniaturization are important in designing electronic sphygmomanometer. Toshiba provides information on a wide range of semiconductor products suitable for power supply units, surge voltage protection units, motor driving units, sensor signal input units, etc., along with circuit configuration examples.
详细信息
智能音响
Such as low power consumption and miniaturization are important in designing smart speaker. Toshiba provides information on a wide range of semiconductor products suitable for power supply units, sensor signal input unit, display unit, etc., along with circuit configuration examples.
详细信息
固态硬盘
Such as low power consumption and miniaturization are important in designing solid state drive (SSD). Toshiba provides information on a wide range of semiconductor products suitable for power supply/power supply management units, surge/ESD protection circuit units, over temperature monitoring unit, etc., along with circuit configuration examples.
详细信息
平板电脑设备
Such as low power consumption and miniaturization are important in designing tablet device. Toshiba provides information on a wide range of semiconductor products suitable for power supply management units, sensor signal input units, display units, over temperature monitoring unit, etc., along with circuit configuration examples.
详细信息
智能手表
Such as low power consumption and miniaturization are important in designing smart watch. Toshiba provides information on a wide range of semiconductor products suitable for power supply and charge management units, sensor signal input units, display units, etc., along with circuit configuration examples.
详细信息
Surveillance Camera
Such as low power consumption and miniaturization are important in designing surveillance camera. Toshiba provides information on a wide range of semiconductor products suitable for power supply units, camera motion control units, etc., along with circuit configuration examples.
详细信息
无线充电器
Such as low power consumption and miniaturization are important in designing wireless charger. Toshiba provides information on a wide range of semiconductor products suitable for power supply unit, inverter circuit unit, etc., along with circuit configuration examples.
详细信息
智能插头
交流隔离、高效率和小型化等对于智能插头的设计非常重要。东芝提供适用于交流开关单元、电源单元、无线和按键开关单元等的各种半导体产品的信息以及电路配置示例。
详细信息

参考设计

PCB图片（示例）
低功耗运算放大器TC75S102F的应用电路
适用于各种传感器的低功耗运算放大器TC75S102F的应用电路。这些应用电路可用于需要长电池寿命的设备、物联网传感器、能量收集系统等。
详细信息
符合48V总线电压的1.2V／100A输出DC-DC转换器的特点
符合48V总线电压的1.2V／100A输出DC-DC转换器
该参考设计提供了1.2V／100A输出隔离式DC-DC转换器的规格，框图和PCB布局数据，该转换器将48V总线电压直接转换为1.2V。
DC-DC / MOSFET / 参考设计
详细信息
300W隔离式DC-DC转换器的特点
300W隔离式DC-DC转换器
介绍了电源的概述，设计参考文件，可以导入到EDA工具的电子文件，以及组成器件的概述
设计／支持 / 参考设计中心
详细信息

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