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About information presented in this cross reference
The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
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公司信息
产品新闻2021年5月
东芝电子元件及存储装置株式会社(“东芝”)推出了采用SO6L封装的光耦产品TLP5771H、TLP5772H和TLP5774H,可通过隔离的控制电路来驱动中小型MOSFET或IGBT栅极。
与现有产品相比[1],新产品的最高工作温度从110℃提高至125℃。新产品的主要特性是工作温度范围为-40~125℃,从而使设计和保持温度余量变得更加容易。
该封装轻薄小巧,最大高度仅为2.3mm,有助于提高系统板上零件布局的灵活性。此外,该封装可安装在东芝使用SDIP6封装[3]的以往产品[2]焊盘上。因此,可以将产品安装在电路板的背面或高度受限的位置,从而取代以往产品。
注:
[1]现有产品:TLP5771、TLP5772和TLP5774
[2]以往产品:使用SDIP6封装的TLP700H和TLP701H
[3]封装高度:4.15mm(最大值)
IGBT/MOSFET隔离栅极驱动器
(除非另有规定,@Ta=-40–125℃)
注:
本文所示应用电路仅供参考。需要进行全面评估,特别是在量产设计阶段。
提供这些应用电路示例并不授予任何工业产权许可。
* 本文档中的产品价格和规格、服务内容和联系方式等信息,在公告之日仍为最新信息,如有变更,恕不另行通知。