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SBD是由半导体与金属的接合形成的单极器件。原则上,SBD没有反向恢复时间,不像使用pn结二极管会引起问题。因此,SBD有助于大幅度降低关断时的开关损耗。
因为传导是由空穴和电子引起的,所以pn结二极管是双极的。pn结二极管具有反向恢复时间,因为在关断期间少数载流子(p层中的电子和n层中的空穴)会保留在结处。相反,单极的SBD没有反向恢复时间。但由于金属和半导体接合处的耗尽区具有电容,因此其充电和放电将产生电流流动。虽然该电容是温度和反向偏压的函数,但在典型的SiC SBD应用所工作的高压区几乎不受影响。
此外,该电容不是电流的函数。与pn结二极管的电容不同,当电流小于额定直流电流时,它几乎不依赖于电流。但是具有MPS结构的SiC SBD在电流超过额定直流值时可能会受到少数载流子的影响。
SBD的电容计算如下:
C(VR)=S x [ ε×q×Nd/{2×(Vbi+VR)}]^0.5
Vbi:内置电压(=金属的功函数—n型(p型)半导体的功函数)
S:结区,ε:介电常数,q:单位电荷,Nd:掺杂浓度
VR:反向偏置电压
虽然Vbi是温度的函数,因为Vbi << VR,所以可忽略。
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