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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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热计算有什么特殊考虑吗?

每个器件都具有不同的热传导路径,但基本而言,您应计算封装内半导体芯片到环境空气的热阻。当考虑系统设计的散热时,应利用这一信息。特别是对于功率器件而言,存在巨大损耗,这将显著影响系统的可靠性和使用寿命。所以在考虑热设计时应格外小心,确保每个器件最大允许结温有足够的余量范围(120°C、150°C等)。

散热片的热设计和安装:功率MOSFET应用说明(PDF:1,061KB)

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