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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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热关断功能可在持续高电流流动且eFuse IC的结温超过阈值时,切断内部输出MOSFET以终止输出电流。
热关断(TSD:过热保护)是当eFuse IC的结温上升至设定值时关断内部MOSFET的一种功能。
自动重试型是指当MOSFET关断并且结温下降至设定值时MOSFET再次导通。
锁存型是在eFuse IC结温升高且TSD已激活后MOSFET保持关断状态。通过EN/UVLO信号执行复位,以解除锁存。
下图显示了自动重试型TSD功能(TCKE8系列)的操作图。
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