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公司信息
产品新闻 2020年11月
东芝电子元件及存储装置株式会社(“东芝”)推出了TLP5751H,TLP5752H和TLP5754H,它们是使用SO6L封装的光耦产品,可以隔离中小容量的IGBT和MOSFET的驱动栅极。
新产品的工作温度(最大值)从现有产品[1]的110°C提高到125°。其主要特性指定了其工作温度额定值为Ta=-40至+125°C,使其更容易设计和保持温度裕度。
该封装轻薄小巧,最大高度为2.3毫米,有助于提高系统板上部件布置的灵活性。此外,该封装可以安装于以往产品[2]采用的SDIP6封装[3]的型式上。因此,产品可以安装在板的背面或高度受限的地方,取代以往产品。
注:
[1] 现有产品:TLP5751,TLP5752,TLP5754
[2] 以往产品:TLP700H,TLP701H
[3] 封装告诉:4.15mm(最大值)
IGBT和MOSFET的隔离栅极驱动电路
(除非另有规定,@Ta=-40至+125°C)
本文所示应用电路仅供参考。需要进行彻底的评估,特别是在量产设计阶段。
提供这些应用电路示例并不表示授予任何工业产权许可。
本文档中的产品价格和规格、服务内容和联系方式等信息,在公告之日仍为最新信息,如有变更,恕不另行通知。