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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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封装产品线
  • 丰富的产品线
  • 双极性输出与双扩散金属氧化物半导体(DMOS)工艺可实现低能耗
  • 通过优化各种可变封装形式,满足客户需求 

您可选择符合自身需求的封装。

封装 典型器件型号 特性
标准型 DIP DIP16-P-300-2.54A
TBD62xxxAPG 通孔;最适合业余爱好、娱乐和工业应用
SOP SOP16-P-225-1.27 TBD62xxxAFG 贴片式
SSOP(0.65) SSOP16-P-225-0.65B TBD62xxxAFNG 贴片式(0.65mm引线间距),缩小式封装
SOL P-SOP16-0410-1.27-002 TBD62xxxAFWG

贴片式、高效率
大电流式 HSOP
HSOP16-P-300-1.00 TBD62xxxAFG 贴片式、大电流、散热片
SSOP(1.00) P-SSOP24-0613-1.00-001 TBD62xxxAFAG 贴片式(1.00mm引线间距),大电流
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