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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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东芝在引线型封装二极管的技术数据表中规定了从结到外壳的热阻,但在表贴式封装二极管的技术数据表中没有规定。
这是因为表面贴装型封装产品的自发热量较小,无法准确测量封装的表面温度。
然而,描述了从结温到环境温度的热阻(Rth (j-a)),因此请将该值用于散热设计。
对于散热设计,请参阅以下应用说明。
关于产品,请参考以下链接。