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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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2-3.热关断的操作
如因环境温度过度升高而导致功耗过大或结温超过阈值，则热关断（TSD）功能会关闭负载开关IC，以保护负载开关IC和使用它的系统。
负载开关IC具有热关断温度和恢复温度。热关断温度是指TSD发生跳闸以关闭负载开关IC的温度。当TSD跳闸时，由此引发的功耗降低会导致其结温下降。达到一定温度时，负载开关IC就会自动重新导通。此温度即为恢复温度。
除非消除TSD跳闸的原因，否则结温会回升，导致负载开关IC进入以下循环：负载开关IC关断 → 结温下降 → 负载开关IC导通 → 结温升高。负载开关IC不应长时间处于过高温下，否则可能会影响系统稳定性或降低负载开关IC的可靠性。必须为系统提供故障安全机制，以防热关断。
以下链接还提供了热关断的说明：
