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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
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Launch of photocouplers for IGBTs and MOSFETs gate drive that are thin, support high temperature operations, and can be mounted on the back side of a board or where height is limited: TLP5751H(LF4), TLP5752H(LF4), TLP5754H(LF4)

Product News 2019-07

The package photograph of launch of photocouplers for IGBTs and MOSFETs gate drive that are thin, support high temperature operations, and can be mounted on the back side of a board or where height is limited: TLP5751H(LF4), TLP5752H(LF4), TLP5754H(LF4).

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the TLP5751H(LF4), TLP5752H(LF4) and TLP5754H(LF4) which are photocoupler products using the SO6L(LF4) package that can drive gates of IGBTs and MOSFETs with small to medium capacity.

The new products have increased their operating temperature (max) to 125 °C from the 110 °C of existing products[1]. The major characteristics have also been specified with the operating temperature ratings (Ta= -40 to +125 °C), making it easier to design and maintain a temperature margin.

The package is slim with a maximum height of 2.3 mm, helping to improve the flexibility in the layout of parts on a system board. In addition, the package can be mounted on the land pattern for our conventional products[2] using the SDIP6(F type) package[3]. Therefore, the products can be mounted on the back side of a board or where height is limited, replacing conventional products.

Notes:
[1] Existing products: TLP5751(LF4), TLP5752(LF4) and TLP5754(LF4)
[2] Conventional products: TLP700HF and TLP701HF
[3] Wider lead bend package than standard package. Package height 4.15 mm (max).

Features

  • Peak output current ratings (@Ta= -40 to +125 °C):
      IOP= ±1.0 A (TLP5751H(LF4))
      IOP= ±2.5 A (TLP5752H(LF4))
      IOP= ±4.0 A (TLP5754H(LF4))
  • High operating temperature ratings: Topr (max)=125 °C
  • Rail-to-rail output

Applications

Gate driver for IGBTs and MOSFETs

  • Industrial equipment (Industrial inverters and power conditioner for photovoltaic inverters, etc.)
  • Home appliance equipment (Air conditioner inverters, etc.)

Product Specifications

(Unless otherwise specified, @Ta= -40 to +125 °C)

Part number TLP5751H(LF4) TLP5752H(LF4) TLP5754H(LF4)
Package SO6L(LF4)
Rail-to-rail output Built-in
Absolute
maximum
ratings
Peak output current  IOPH, IOPL  (A) ±1.0 ±2.5 ±4.0
Electrical
characteristics
Supply voltage  VCC min/max  (V) 15 / 30
Supply current  ICCH, ICCL max  (mA) 3.0
Threshold Input current(L/H)  IFLH max  (mA) 4
Propagation delay time  tpLH, tpHL max  (ns) 150
Propagation delay skew  tpsk min/max  (ns) -80 / +80
Common-mode transient immunity
CMH, CML min  (kV/μs)
@Ta=25 °C
±35

Pin Assignment

The illustration of pin assignment of launch of photocouplers for IGBTs and MOSFETs gate drive that are thin, support high temperature operations, and can be mounted on the back side of a board or where height is limited: TLP5751H(LF4), TLP5752H(LF4), TLP5754H(LF4).

Application Circuit Example

The illustration of application circuit example of launch of photocouplers for IGBTs and MOSFETs gate drive that are thin, support high temperature operations, and can be mounted on the back side of a board or where height is limited: TLP5751H(LF4), TLP5752H(LF4), TLP5754H(LF4).

The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass-production design stage.
Providing these application circuit examples does not grant any license for industrial property rights.

Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.

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