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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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功耗的定义是什么?

功耗是指MOSFET在指定的热条件下可以连续耗散的最大功率。当安装无穷大散热片时,定义了通道(ch)与外壳(c)或通道(ch)与环境空气(a)之间的功耗。
当散热片链接到MOSFET时,根据以下各项的总和计算出功耗:1)通道与外壳之间的热阻(内部热阻);2)绝缘体的热阻;3)接触热阻;及4)散热片的热阻。对于封装在贴片式封装中的MOSFET,如果安装在板上,则有指定的功耗。关于板的尺寸,详见单独的技术数据表。

 允许的功耗随使用MOSFET的条件(例如,环境温度和散热条件)相应变化。实际上,在最终应用环境中应根据通道至环境的热阻来计算功耗。

散热片的热设计和连接:功率MOSFET应用说明(PDF:1,061KB)

最大额定值:功率MOSFET应用说明(PDF:1,075KB)

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