Asia-Pacific
English
简体中文
繁體中文
한국어
日本語
Americas
English
Europe (EMEA)
English



型号搜索

交叉搜索

About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

关键词搜索

参数搜索

库存查询与购买

适用于光耦的安全标准有哪些要求?如何规定产品的具体要求?

隔离电压、绝缘层厚度、爬电距离、间隙

光耦封装形状和介电强度必须符合安全标准。因此,与其它半导体产品不同,光耦的封装设计受到限制。

  • 爬电距离:沿着绝缘体表面的两个导体(输入-输出)之间的最短距离
  • 间隙:空中两个导体之间的最短距离
  • 绝缘层厚度:两个导体之间绝缘体的最小厚度
  • 隔离电压:两个导体之间的隔离电压。UL标准将该电压指定为一分钟内不用施加交流电而破坏绝缘层的电压。

对于东芝光耦,各技术文件中均提供适用这些数值的数据。

在新窗口打开