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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
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一方面,为实现无碳社会,节能引起人们广泛关注,另一方面,电力需求也在不断增长。小型高效电力转换系统的需求迅速增加。不仅促进了Si(硅)功率半导体器件性能的提高,还引入了化合物功率半导体器件。我们将扩展Si功率半导体器件产品线并提高产能。在化合物半导体方面,我们的SiC(碳化硅)半导体产品已实现商业化。此外,我们正在推动GaN(氮化镓)功率器件的开发。
通过提供更易于使用的高性能GaN功率器件,我们帮助客户降低设备功耗并减小尺寸。
Si器件是目前功率器件的主流。SiC器件以其良好的导热性在大功率、高能效应用方面更具前景。GaN器件具有更好的开关特性,适于高效及小型化应用。
GaN是一种具有高临界击穿场强、高电子迁移率的半导体材料。用于半导体器件可提高开关速度,降低导通电阻。由于开关频率高,减少了冷却单元数量,GaN有助于降低功耗、提高输出,减小客户设备尺寸。
由于采用东芝原创常开+共源共栅级联结构,因此便于通过串联栅极电阻(Rg)控制开关转换速率(dVDS/dt)。
(传统级联型结构难以控制。)
东芝原装外围电路及相应电路板设计
VDSS:650V
RDS(ON):54mΩ(典型值)
Package:QFN9×9(9mm×9mm)
提高抗噪能力
采用原创常开型器件,可保证更高的Vth,不易产生故障。(一般常关JFET,Vth约为1.2V)
高效
在我们的图腾柱PFC板测试样品上,效率高达99.4%(~2.5kW)
经确认效率高于其他器件。