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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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查找您下一个设计所需要的一切。只需选择一个应用,然后单击以查看框图,即可找到我们的半导体解决方案。

采用与高压兼容的小型贴片式封装减小安装面积

包装尺寸对比

在传统双列直插式封装为主流的小型电机市场,需要实现高密度安装和易于安装的小型贴片器件(SMD)封装。除了通过使用外露焊盘(E-Pad)实现有效散热封装的HSSOP31外,我们还引入了使用多芯片模块的新型高效SSOP30系列。电机系统性能有望得到改善。

HSSOP31和SSOP30是我们的小型封装,分别比DIP26传统双列直插式封装小61%和47%。

在HSSOP31和SSOP30中,高压端子和低压端子在封装的两侧分开,高压端子之间的距离大于2.4mm。这些封装的高度为2.2mm(最大值),并可以内置于模具电机中的控制板。

3相直流无刷电机驱动IC

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