采用与高压兼容的小型贴片式封装减小安装面积
在传统双列直插式封装为主流的小型电机市场，需要实现高密度安装和易于安装的小型贴片器件（SMD）封装。除了通过使用外露焊盘（E-Pad）实现有效散热封装的HSSOP31外，我们还引入了使用多芯片模块的新型高效SSOP30系列。电机系统性能有望得到改善。
HSSOP31和SSOP30是我们的小型封装，分别比DIP26传统双列直插式封装小61%和47%。
在HSSOP31和SSOP30中，高压端子和低压端子在封装的两侧分开，高压端子之间的距离大于2.4mm。这些封装的高度为2.2mm（最大值），并可以内置于模具电机中的控制板。
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