- 型号搜索
- 交叉搜索
- 关键词搜索
- 参数搜索
- 库存查询与购买
This webpage doesn't work with Internet Explorer. Please use the latest version of Google Chrome, Microsoft Edge, Mozilla Firefox or Safari.
请输入3个以上字符
The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
请输入3个以上字符
对于小封装器件，为什么没有规定结到外壳（或通道到外壳）热阻？
因为小封装器件不会散发大量热量，也因为小封装表面的温度无法精确测量，所以未规定结到外壳的热阻（Rth（j-c））和通道到外壳的热阻（Rth（ch-c））。对于热设计，可使用结到环境的热阻（Rth（j-a））或通道到环境的热阻（Rth（ch-a））进行代替。