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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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对于小封装器件，为什么没有规定结到外壳（或通道到外壳）热阻？
对于小封装器件，通常不会给出结到壳热阻（Rth(j-c)）或沟道到壳热阻（Rth(ch-c)）的参数。
这是因为散热主要通过引脚进行，而封装本体的表面积非常小，使得难以准确界定和测量具有代表性的壳体温度。
因此，结到壳热阻或沟道到壳热阻并不适合作为小封装器件热评估的参数。
关于结温或沟道温度的计算方法，请参阅以下常见问题（FAQ）：
> 数据表中未包括“热阻”值的半导体器件的结点温度计算方法