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双极结型晶体管(BJT)的设计为在正确连接时提供最佳性能。当反向连接时,其性能较差(低 hFE)。然而,能够施加到集电极-基极电压的电压非常低。该电压不能超过绝对最大额定值(VEBO)(表1)。互换集电极和发射极端不仅会降低晶体管性能,还可能对器件造成永久性损坏。
通常,双极晶体管的设计需保证实现高hFE。为实现此目的,发射极中的大量载流子(在npn晶体管中为电子)必须扩散至基极区,然后有效地穿过基极区进入集电极。还必须控制集电极区中的耗尽层,以增强晶体管的耐受电压(即集电极-基极电压,VCBO)。可通过以下方式满足这些条件:
因此,三个半导体区域中的掺杂浓度具有以下关系:发射极>>基极>集电极。
普通晶体管由于集电极浓度低而保持高击穿电压(VCBO/VCEO)。 如果反向连接,高浓度发射极将充当集电极,能够施加的电压(VEBO)将变得极低。
如果集电极端子和发射极端子反向连接,则不满足上述关系。在这种情况下,hFE会降低,从而使双极晶体管无法按预期工作,并可能导致基极电流超过其规定的额定值。此外,由于VCEO降低,晶体管关断时可能会击穿。由于上述原因,反向连接的晶体管可能会永久损坏。
除了设计为反向连接的静音晶体管*外,必须按正常方向连接典型的双极晶体管。
*目前,东芝不提供静音晶体管。
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