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2024年06月20日
东芝电子元件(上海)有限公司
随着电子设备上电子元件越来越密集和复杂,半导体和电子元件所产生的热量也在不断增加。因此,过温检测解决方案变得日益重要。
针对这一问题的解决,本次研讨会将从Thermoflagger™的定义、使用方法及其特性、以及新产品系列和应用示例这几个方面介绍东芝的过温检测解决方案和Thermoflagger™。。
✧ 研讨会时间:2024年06月27日(周四)上午10:00
✧ 主讲:刘翠(半导体技术统括部工程师)
本文档中的产品价格和规格、服务内容和联系方式等信息,在公告之日仍为最新信息,如有变更,恕不另行通知。