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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
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当功率在半导体器件中耗散时,结点温度升高。
温升ΔTj如下所示
ΔTj[deg.C]= Rth [deg.C/W] × PLOSS[W]
ΔTj:结点温升
Rth:热阻
PLOSS:半导体器件中的耗散功率
结点温度如下所示:
Tj = ΔTj + Ta
Tj:结点温度
Ta:环境温度
*在双极晶体管中,Tj表示结点温度。
在MOSFET中,用Tch代替Tj,表示结温。
关于结点温度的计算,请参考“散热片的热设计和安装: 功率MOSFET应用说明