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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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漏极电流(DC)(硅极限)表示单个硅单元的电流承载能力,未考虑封装和安全工作区域的限制。
漏极电流(DC)(硅极限)不是指实际可以施加到产品上的电流。 它表示硅芯片的载流能力,作为与其他产品比较的参考。 换句话说,它表示在不考虑封装和安全工作区域等限制的情况下,作为单个硅单元来看的通电容量。 可应用于产品的漏极电流(DC)受产品封装的载流能力、结温最大值和安全工作区域的限制。
绝对最大额定值(注)(除非另有说明,否则 Ta=25°C)
特性 | 符号 | 额定值 | 单位 |
---|---|---|---|
漏极-源极电压 | VDSS | 30 | V |
栅极-源极电压 | VGSS | ±20 | |
漏极电流(DC)(Tc=25 ºC) | ID | 150 | A |
漏极电流(DC)(硅极限) | ID | 420 | A |
漏极电流(脉冲)(t=100µs) | IDP | 500 | A |
功耗(Tc=25ºC) | PD | 210 | W |
功耗 | PD | 3 | W |
功耗 | PD | 0.96 | W |
单脉冲雪崩能量 | EAS | 393 | mJ |
单脉冲雪崩电流 | IAS | 120 | A |
结温 | Tch | 175 | °C |
存储温度 | Tstg | -55至175 | °C |
表 1:绝对最大额定值示例
另请参阅下面的产品页面。