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光耦的类型（内部结构）
下载“第Ⅴ章：光半导体” (PDF:1.8MB)
由于要求的绝缘性能、封装尺寸和内部芯片尺寸等限制，光耦具有不同类型的内部封装结构。
单模透射型：
框架式LED和框架式光电探测器采用面对面的模压封装。LED与光电探测器之间的透光部件采用硅树脂材料。
带膜的单模透射型：
为了提高隔离电压，可在LED和光电探测器之间插入聚酰亚胺薄膜。
双模透射型：
在这种透射结构中，内模为白色，外模为黑色。红外线透光率高的树脂用于透光部件的白色模具。
反射型：
框架式LED和框架式光电探测器位于同一平面。LED光在硅树脂中反射并到达光电探测器。因此，它被称为反射型。
