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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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用于电子元件的半导体具有高性能和高密度,并且制造工艺经过改进以缩小尺寸。缩小尺寸后往往会降低元件对ESD的耐受性。鉴于通过USB连接设备的机会很多,ESD保护正日益彰显其重要性。