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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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必须保护电子设备的电路免受静电放电(ESD)等瞬态高电压的损害。
电子设备中使用的半导体具有高性能和高密度,制造工艺不断改进以缩小其尺寸。尺寸缩小往往会降低器件对静电放电(ESD)的耐受能力。此外,器件连接越来越多地通过USB等接口以及板对板连接器进行外部连接,这增加了连接过程中发生静电放电的风险。
相关说明请参见以下资料。