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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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封装 3D数据（STEP）
半导体封装的3D数据（STEP格式）已公开。
按产品下载
您可以直接从每个产品类别的参数搜索结果中下载特定产品的模型文件，这将有助于您下载所需产品的模型。
| 按产品 | ■MOSFET |
■双极晶体管／IGBT |
■二极管 |
|---|---|---|---|
■隔离器／固态继电器 |
■通用逻辑IC |
■电源管理IC |
|
■智能功率IC |
■线性IC |
您可以从参数搜索结果中选择封装并下载。
| 按封装 |
|---|
您可以通过下面的下载按钮一次性下载所有封装的STEP文件。
| 产品类别 | 日期 | 文件大小 | 下载 |
|---|---|---|---|
| 3D数据（ STEP） | 2024年6月 | 7.5MB |