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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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库存查询与购买

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选择应用

查找您下一个设计所需要的一切。只需选择一个应用,然后单击以查看框图,即可找到我们的半导体解决方案。

封装与包装信息

我们介绍了东芝半导体的封装尺寸和封装方法。
在开发设计时,请确认规格书。

下载CAD工具的封装数据,比如步骤格式的三维模型数据和按照JEITA ET-7501级别3设计的参考封装型式数据。

  • 3D模型(.stp):步骤格式的三维模型数据
  • 封装型式(.dxf):DXF格式的封装型式数据t
  • 封装型式(.xml):JEITA LPB C-格式的封装型式数据
  • 封装型式(.dra):Cadence® OrCAD®的封装型式数据
  • 封装型式(.ftp):Zuken®CR-5000/CR-8000的封装型式数据

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封装安装指南

本在线文件描述了提高产品钎焊性能和散热性的设计技术和安装方法,旨在生产具有高的可制造性能的印刷电路板组件(PCBA)。

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