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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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封装与包装信息
我们介绍了东芝半导体的封装尺寸和封装方法。
在开发设计时，请确认规格书。
下载CAD工具的封装数据，比如步骤格式的三维模型数据和按照JEITA ET-7501级别3设计的参考封装型式数据。
分立器件封装
- 3D模型（.stp）：步骤格式的三维模型数据
- 封装型式（.dxf）：DXF格式的封装型式数据t
- 封装型式（.xml）：JEITA LPB C-格式的封装型式数据
- 封装型式（.dra）：Cadence® OrCAD®的封装型式数据
- 封装型式（.ftp）：Zuken®CR-5000／CR-8000的封装型式数据
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封装安装指南
本在线文件描述了提高产品钎焊性能和散热性的设计技术和安装方法，旨在生产具有高的可制造性能的印刷电路板组件（PCBA）。
