丰富的封装系列
东芝可提供多种封装产品，从通用SMV（SOT-25）封装到紧凑型WCSP封装和SDFN4封装。对于需要紧凑型和薄型LDO的模块等应用，东芝有一系列薄型封装，最佳厚度最大为0.33毫米。
对于小型和薄型移动设备和模块化设备，建议采用0.645mm×0.645mm 高 0.33mm的WCSP4F封装和1.2mm×0.8mm高0.33mm的WCSP6F封装。东芝也是世界上率先量产1.2×1.2mm DFN5B的厂商，这款产品作为模压封装智能手机的摄像头电源非常受欢迎。SMVs（SOT-25）也很受欢迎，它在消费类产品中易于操作。这些封装产品均在日本和泰国生产，质量高且稳定。
封装搜索
All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.
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