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当二极管和其它半导体器件导通时,由于自由电子和空穴(载流子)而产生电流。此外,这些载流子作为电荷积聚在跨结形成的耗尽区或寄生电容器中,并且还作为过剩载流子积聚在轻掺杂区中。(这会导致上述电导率调制。)当这些器件从导通状态转换到关断状态时,它们会像电容器一样释放电子。所产生的电子流动作为反方向的电流流动接受观察。
正向电压(VF)为正,而电流(IF)介于零和峰值反向恢复电流(Irr)之间。在此期间,耗尽区和寄生电容器的电荷主要被释放,导致负电流流动。一旦iF达到Irr,导致电导率调制的过剩载流子(电子和空穴)就会消失,因为它们会再结合。因此,这种再结合所需的时间取决于载流子的寿命。
如上所述,电导率调制发生在双极器件(如pn结二极管)中,理论上不会发生在单极器件(如SBD)中。因此,SBD的反向恢复时间几乎为零。
图3-9比较了两种典型pn结二极管的反向恢复特性,即CRG09A整流二极管(VR=400V,IF=1A)和CMF02A快速恢复二极管(VR=600V,IF=1A),以及CMS20I40A SBD(VR=40V,IF=2A)。虽然由于它们的最大额定反向电压不同,很难进行简单的比较,但快速恢复二极管(FRD)的反向恢复时间远远小于整流二极管,而SBD的反向恢复时间几乎为零。