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封装

Toshiba Package Name	2-153A1A
Package Image
Mounting	Surface Mount
Width×Length×Height (mm)	152×62×20.5
Package Dimensions	查看
Ultra Librarian^® CAD model (Symbol, Footprint and 3D model)	Download from UltraLibrarian^® in your desired CAD format 1 3
SamacSys CAD model (Symbol, Footprint and 3D model)	Download from SamacSys 2 3

Please refer to the link destination to check the detailed size.

*1	Ultra Librarian^® is a Registered trademark and CAD model library of EMA (EMA Design Automation, Inc.). CAD models (Symbol/Footprint /3D model) are provided by UltraLibrarian^®. The footprints are generated based on the specifications of Ultra Librarian^®.
*2	SamacSys is a wholly owned subsidiary of Supplyframe, Inc. CAD models (Symbol/Footprint /3D model) are provided by Supplyframe, Inc. The footprints are generated based on the specifications of SamacSys.
*3	Please note that the footprint dimensions may differ from the reference Land Pattern dimensions provided on our website.

绝对最大额定值

项目	符号	值	单位
Drain current (DC)	I_D	600	A
Drain-Source voltage	V_DSS	1200	V
Channel temperature	T_ch	150	℃

电气特性

项目	符号	条件	值	单位
Drain-source on-voltage(Sense terminal) (Typ.)	V_DS(on)sense	I_D=600A T_ch=25℃ V_GS=20V	0.9	V
Source-drain off-voltage(Sense terminal) (Typ.)	V_SD(off)sense	I_S=600A T_ch=25℃ V_GS=-6V	1.6	V
Turn-on switching loss (Typ.)	E_on	-	25	mJ
Turn-off switching loss (Typ.)	E_off	-	28	mJ
Reverse recovery loss (Typ.)	E_rr	-	0.8	mJ

文档

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数据表 MG600Q2YMS3 数据表/日文

PDF: 689KB

Aug,2024

数据表 MG600Q2YMS3 数据表/英文

PDF: 594KB

Aug,2024

Simulation Model LTspice Model *1 ZIP

ZIP: 12KB

Dec,2024

Simulation Model PLECS Model *2 ZIP

ZIP: 8KB

Jan,2026

相关技术数据 SiC MOSFET module Gate drive application note

PDF: 420KB

Nov,2024

相关技术数据 SiC MOSFET module application note Electrical characteristics

PDF: 1094KB

Jun,2024

相关技术数据 SiC MOSFET Module Application Note 2-153A1A Handling Instruction

PDF: 531KB

Jun,2024

相关技术数据 SiC MOSFET module application note Reliability

PDF: 458KB

Jun,2024

*1	LTspice ^® is a trademark and simulation software of ADI (Analog Devices, Inc.).
*2	PLECS ^® is a registered trademark of Plexim, Inc.

Notes

The Part Number column shows representative part numbers only, which may not be available for sale in the precise form shown. Each Part Number constitutes a product family which may contain multiple associated product configurations.
(#) Under the RoHS Compatible Product(s) column, "Available" means at least one RoHS-Compatible product is available for sale in the corresponding product family. "None" means no RoHS Compatible product is available in that product family. For Toshiba's definitions of concepts related to the RoHS Directive and RoHS Compatibility, please click here.
The RoHS compatibility information provided herein is to the best of Toshiba's knowledge and belief accurate as of the date Toshiba entered the information into this database. Information is subject to change at any time without notice.
Please contact your Toshiba sales representative for detailed environmental information about each specific part number or product, such as RoHS compatibility or material content. Please use Toshiba products only in compliance with all applicable laws and regulations concerning the inclusion or use of controlled substances, including without limitation the RoHS Directive.TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
Reliability data are provided for your reference only, please contact your Toshiba sales representative for detailed reliability information about each part number.
For product delivery, additional characters will be added to the part numbers shown on this website. For details, please ask your local distributor, or send an inquiry accessed from "Contact Us" on this website.

Feature	All SiC MOSFET type
Application	High power switching (Power conversion, Motor drive)
Circuit Configuration	2in1
RoHS Compatible Product(s) (#)	Available

车身电子

xEV

车载信息娱乐系统

高级驾驶辅助系统（ADAS）

底盘

基础设施

建筑管理系统（BEMS）／健康管理系统（HEMS)

工厂自动化

商用设备

IoT设备

卫生保健

可穿戴设备

移动

电脑周边

家用电器

分立半导体

二极管

晶体管

通用逻辑IC

模拟器件

数字器件

无线器件

SiC功率器件

光耦

数字隔离器

固态隔离器

光纤传输模块

其他产品用IC

其他内容

MG600Q2YMS3

产品概要

封装

绝对最大额定值

电气特性

文档

可订购器件型号

技术咨询

相关信息

Notes