TC35667IFTG-006

停产产品

Bluetooth® IC

产品概要

Feature Automotive / LE single / Scatternet support / Standalone mode support
Automotive Support Available
Bluetooth Category Bluetooth® low energy
Bluetooth Core spec. 4.1
Embedded Profiles GATT / SMP
Interfacing I2C / SPI / UART / PWM / ADC
User RAM Size (KB) 32
User Flash Size (KB) –
Function ARM® ARM7TDMI-S™ / RF analog circuitry / DC-DC converter / low power mode(4 level)
Other Functions Scatternet
RoHS Compatible Product(s) (#) Please contact us.
Status Not recommended for new design

封装

Toshiba Package Name P-VQFN40-0606-0.50-001
Package Image 东芝 TC35667IFTG-006 Bluetooth<sup>&reg;</sup> IC产品 P-VQFN40-0606-0.50-001 封装图片
Package name QFN
Pins 40
Mounting Surface Mount
Package size 6.0 mm x 6.0 mm
Pin pitch 0.5 mm
Package Dimensions 查看
Land pattern dimensions 查看

 Please refer to the link destination to check the detailed size.

电气特性

项目 符号 条件 值 单位
Operating Temperature (Max) Topr - 85 ℃
Operating Temperature (Min) Topr - -40 ℃
Power supply voltage (Max) - - 3.6 V
Power supply voltage (Min) - - 1.8 V
Current Consumption in RX Active mode (peak) IRX (3.0V) 6.3 mA
Current Consumption in TX Active mode (peak) ITX (3.0V, TX -4dBm) 6.3 mA
Current Consumption in Sleep mode ISleep - 10 μA
Current Consumption in Deep Sleep mode IDSleep - 0.05 μA
Transmit Power(Max) PTrans - 0 dBm
Receiver Sensitivity - - -92 dBm

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