DF2B5BSL

ESD protection diode (bi-directional type)

产品概要

Internal Connection Single
Number of Circuits 1
Number of Protected Lines 1
Configuration Bidirectional
Application USB1.1 / Audio / SIM-Card / Power supply / General-purpose
RoHS Compatible Product(s) (#) Available

封装

package name (TOSHIBA) SOD-962 (SL2)
Package Image SL2
package code SOD-962
Pins 2
Mounting Surface Mount
Width×Length×Height
(mm)
0.62×0.32×0.3
Package Dimensions 查看
Land pattern dimensions 查看
SamacSys CAD model
(Symbol, Footprint and 3D model)
Download from SamacSys<br>(Note1)(Note2)

Download from SamacSys
(Note1)(Note2)

 Please refer to the link destination to check the detailed size.

(Note1)

SamacSys is a wholly owned subsidiary of Supplyframe, Inc. CAD models (Symbol/Footprint /3D model) are provided by Supplyframe, Inc. The footprints are generated based on the specifications of SamacSys.

(Note2)

Please note that the footprint dimensions may differ from the reference Land Pattern dimensions provided on our website.

绝对最大额定值

项目 符号 单位
Electrostatic discharge voltage(IEC61000-4-2) VESD +/-23 kV
Peak pulse current (IEC61000-4-5) IPP 8 A

电气特性

项目 符号 条件 单位
Working peak reverse voltage (Max) VRWM - +/-3.3 V
Total Capacitance (Max) CT VR=0V
f=1MHz
14 pF
Total Capacitance (Typ.) CT VR=0V
f=1MHz
11 pF
Dynamic resistance (Typ.) Rdyn IPP=8A to 30A 0.2 Ω
Reverse Breakdown Voltage (Min) VBR IBR=1mA 3.7 V
Reverse Current (Max) IR VRWM=3.3V 0.1 μA
Clamp voltage (Based on IEC61000-4-5) (Typ.) VC IPP=1A 5.5 V
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(Note1)

LTspice ® is a trademark and simulation software of ADI (Analog Devices, Inc.).

(Note2)

SIMetrix® is simulation software and registered trademarks of SIMetrix Technologies Ltd.

(Note3)

ELDO™ is a trademark and simulation software of Siemens Industry Software Inc.
Click here for the list of trademarks related to Siemens Industry Software Inc.

可订购器件型号

Orderable part number
(example)
MOQ(pcs) Reliability
Information
RoHS Note
DF2B5BSL,L3F 10000 Yes General Use

应用

智能手表
低功耗和小型化对于智能手表的设计非常重要。东芝提供了适用于电源和充电管理单元、传感器信号输入单元、显示单元等的各种半导体产品的信息以及电路配置示例。
智能音响
低功耗和小型化等对于智能音响的设计非常重要。东芝提供了适用于电源单元、传感器信号输入单元、显示单元等的各种半导体产品的信息以及电路配置示例。

技术咨询

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常见问题

常见问题(FAQ)

Notes

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