CUHS20F30

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Feature	High-speed switching
Internal Connection	Single
Number of Circuits	1
RoHS Compatible Product(s) (#)	Available

封装

Toshiba Package Name	SOD-323HE (US2H)
Package Image
Package Code	SOD-323HE
Pins	2
Mounting	Surface Mount
Width×Length×Height (mm)	2.5×1.4×0.60
Package Dimensions	查看
Land pattern dimensions	查看
Ultra Librarian^® CAD model (Symbol, Footprint and 3D model)	Download from UltraLibrarian^® in your desired CAD format (Note1)(Note3)
SamacSys CAD model (Symbol, Footprint and 3D model)	Download from SamacSys (Note2)(Note3)

Please refer to the link destination to check the detailed size.

(Note1)	Ultra Librarian^® is a Registered trademark and CAD model library of EMA (EMA Design Automation, Inc.). CAD models (Symbol/Footprint /3D model) are provided by UltraLibrarian^®. The footprints are generated based on the specifications of Ultra Librarian^®.
(Note2)	SamacSys is a wholly owned subsidiary of Supplyframe, Inc. CAD models (Symbol/Footprint /3D model) are provided by Supplyframe, Inc. The footprints are generated based on the specifications of SamacSys.
(Note3)	Please note that the footprint dimensions may differ from the reference Land Pattern dimensions provided on our website.

绝对最大额定值

项目	符号	值	单位
Average Forward Current	I_O	2	A
Reverse Voltage	V_R	30	V

电气特性

项目	符号	条件	值	单位
Total Capacitance (Typ.)	C_T	V_R=0V f=1MHz	380	pF
Forward Voltage (Max)	V_F	I_F=500mA	0.37	V
Forward Voltage (Max)	V_F	I_F=1000mA	0.41	V
Forward Voltage (Max)	V_F	I_F=2000mA	0.47	V
Forward Voltage (Typ.)	V_F	I_F=500mA	0.31	V
Forward Voltage (Typ.)	V_F	I_F=1000mA	0.35	V
Forward Voltage (Typ.)	V_F	I_F=2000mA	0.40	V
Reverse Current (Max)	I_R	V_R=30V	0.06	mA

Orderable part number (example)	MOQ(pcs)	Reliability Information	RoHS	Note
CUHS20F30,H3F	3000		Yes	General Use

应用

无线充电器

低功耗和小型化对于无线充电器的设计非常重要的。东芝提供了适用于电源单元、逆变器电路单元等的各种半导体产品的信息以及电路配置示例。

详细信息

固态硬盘

低功耗和小型化对于固态硬盘（SSD）的设计非常重要。东芝提供了适用于电源/电源管理单元、浪涌／ESD 保护电路单元、过热监控单元等的各种半导体产品的信息以及电路配置示例。

详细信息

电动牙刷

低功耗和小型化对于电动牙刷的设计非常重要。东芝提供了适用于电源/电源管理单元、电机控制单元、传感器信号输入单元等的各种半导体产品的信息以及电路配置示例。

详细信息

服务器

在设计服务器时，低功耗和小型化等非常重要。东芝提供了适用于电源单元、电机驱动单元、过温监控单元等的各种半导体产品的信息以及电路配置示例。

详细信息

Notes

The Part Number column shows representative part numbers only, which may not be available for sale in the precise form shown. Each Part Number constitutes a product family which may contain multiple associated product configurations.
(#) Under the RoHS Compatible Product(s) column, "Available" means at least one RoHS-Compatible product is available for sale in the corresponding product family. "None" means no RoHS Compatible product is available in that product family. For Toshiba's definitions of concepts related to the RoHS Directive and RoHS Compatibility, please click here.
The RoHS compatibility information provided herein is to the best of Toshiba's knowledge and belief accurate as of the date Toshiba entered the information into this database. Information is subject to change at any time without notice.
Please contact your Toshiba sales representative for detailed environmental information about each specific part number or product, such as RoHS compatibility or material content. Please use Toshiba products only in compliance with all applicable laws and regulations concerning the inclusion or use of controlled substances, including without limitation the RoHS Directive.TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
Reliability data are provided for your reference only, please contact your Toshiba sales representative for detailed reliability information about each part number.
For product delivery, additional characters will be added to the part numbers shown on this website. For details, please ask your local distributor, or send an inquiry accessed from "Contact Us" on this website.

(Note1)	LTspice ^® is a trademark and simulation software of ADI (Analog Devices, Inc.).
(Note2)	SIMetrix^® is simulation software and registered trademarks of SIMetrix Technologies Ltd.
(Note3)	ELDO™ is a trademark and simulation software of Siemens Industry Software Inc. Click here for the list of trademarks related to Siemens Industry Software Inc.

车身电子

xEV

车载信息娱乐系统

高级驾驶辅助系统（ADAS）

底盘

基础设施

建筑管理系统（BEMS）／健康管理系统（HEMS)

工厂自动化

商业设备

IoT设备

卫生保健

可穿戴设备

移动

电脑周边

家用电器

SiC功率器件

光耦

数字隔离器

固态隔离器

光纤传输模块

分立半导体

二极管

晶体管

通用逻辑IC

模拟器件

数字器件

无线器件

高频二极管

其他内容

产品概要

封装

绝对最大额定值

电气特性

文档

可订购器件型号

应用

技术咨询

相关信息

Notes