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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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IEGT(PPI)

PPI是压装式IEGT。PPI是内置IEGT芯片的压力接触式大功率器件。PPI通过低损耗芯片和高可靠性封装帮助实现节能、小型化和高效率。

压装式IEGT(PPI)
将多个IEGT芯片以阵列形式放置于同一平面上,用钼板将单个IEGT芯片从两端均匀地压入。每个IEGT芯片的集电极和发射极将在机械压力的作用下通过钼板接触到压装式外壳的相应铜电极。这不仅实现了电气连接也保证了热耗散。
PPI Structure and Cross-Sectional View Of a PPI
工作原理
IEGT是一种利用电压驱动来控制大电流的大功率器件,通过设计IGBT发射极的元素结构,改善了因集电极-发射极电压的升高而使通态电压急剧升高的现象。*

*IGBT:绝缘栅双极晶体管
Cross-Sectional View of and Carrier Distribution in an IEGT

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