TC35676FSG-001

停产产品

Bluetooth® IC

产品概要

Feature LE single / User Flash / Scatternet support / Standalone mode support / Small QFN package
Automotive Support
Bluetooth Category Bluetooth® low energy
Bluetooth Core spec. 4.1
Embedded Profiles GATT / SMP
Interfacing I2C / SPI / UART / PWM / ADC
User RAM Size (KB) 64
User Flash Size (KB) 192
Function ARM® ARM7TDMI-S™ / RF analog circuitry / DC-DC converter / low power mode(4 level)
Other Functions Scatternet
RoHS Compatible Product(s) (#) Available
Status Not recommended for new design

封装

Toshiba Package Name P-VQFN40-0505-0.40-002
Package name QFN
Pins 40
Mounting Surface Mount
Package size 5.0 mm x 5.0 mm
Pin pitch 0.5 mm
Package Dimensions 查看

 Please refer to the link destination to check the detailed size.

电气特性

项目 符号 条件 单位
Operating Temperature (Max) Topr - 85
Operating Temperature (Min) Topr - -40
Power supply voltage (Max) - - 3.6 V
Power supply voltage (Min) - - 1.8 V
Current Consumption in RX Active mode (peak) IRX (3.0V) 6.3 mA
Current Consumption in TX Active mode (peak) ITX (3.0V, TX -4dBm) 6.3 mA
Current Consumption in Sleep mode ISleep - 15 μA
Current Consumption in Deep Sleep mode IDSleep - 0.05 μA
Transmit Power(Max) PTrans - 0 dBm
Receiver Sensitivity - - -92 dBm

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