| Feature | BR+LE dual / Small BGA Package / LE Secure Connection supoort |
|---|---|
| Automotive Support | – |
| Bluetooth Category | Bluetooth® dual-mode |
| Bluetooth Core spec. | 4.2 |
| Embedded Profiles | GATT / SMP / SPP |
| Interfacing | I2C / SPI / UART |
| User RAM Size (KB) | – |
| User Flash Size (KB) | – |
| Function | ARM® ARM7TDMI-S™ / RF analog circuitry / low power mode |
| Other Functions | LE secure connection |
| RoHS Compatible Product(s) (#) | Available |
| Status | Under mass production |
| Toshiba Package Name | P-TFBGA64-0505-0.50 |
|---|---|
| Package name | BGA |
| Pins | 64 |
| Mounting | Surface Mount |
| Package size | 5.0 mm x 5.0 mm |
| Pin pitch | 0.5 mm |
| 项目 | 符号 | 条件 | 值 | 单位 |
|---|---|---|---|---|
| Operating Temperature (Max) | Topr | - | 85 | ℃ |
| Operating Temperature (Min) | Topr | - | -40 | ℃ |
| Power supply voltage (Max) | - | - | 3.6 (*2) | V |
| Power supply voltage (Min) | - | - | 1.7 (*2) | V |
| Current Consumption in RX Active mode (peak) | IRX | (3.3V) | 63 | mA |
| Current Consumption in TX Active mode (peak) | ITX | (3.3V) | 63 | mA |
| Current Consumption in Sleep mode | ISleep | - | 30 | μA |
| Transmit Power(Max) | PTrans | - | 1 | dBm |
| Receiver Sensitivity | - | - | -91 | dBm |
(*2) Power supply voltage: 1.7 to 1.9 or 2.7 to 3.6.