半导体继电器系统接线盒电路示例
器件型号 |
|
导通电阻(最大值) |
封装 |
---|---|---|---|
40 |
3.8 |
||
120 |
1.35 |
||
150 |
0.79 |
||
150 |
0.79 |
||
XPJR6604PB * |
(200) |
(0.66) |
S-TOGL™ |
400 |
0.30 |
L-TOGL™ |
*:开发中(括号内的数值为暂定规格。规格如有更改,恕不另行通知。)
器件型号 | SSM3K7002KF | SSM3J168F | SSM3J66MFV | |
---|---|---|---|---|
封装 | ||||
VDSS[V] | 60 | -60 | -20 | |
ID[A] | 0.4 | -0.4 | -0.8 | |
RDS(ON)@|VGS|=4.5V[Ω] | 典型值 | 1.2 | 1.4 | 0.31 |
最大值 | 1.75 | 1.9 | 0.39 | |
驱动电压[V] | 4.5 | -4.0 | -1.2 | |
极性 | N沟道 | P沟道 | P沟道 |
*表示UFM封装
器件型号 | NPN(BRT) | PNP(BRT) | |
---|---|---|---|
封装 | ES6 (SOT-563) | RN1907FE | RN2907FE |
US6 (SOT-363) | RN1901 | RN2901 | |
VCEO[V] | 50 | -50 | |
IC[mA] | 100 | -100 |
器件型号 | DF3D18FU | DF3D29FU | DF3D36FU |
---|---|---|---|
封装 | USM (SOT-323) | ||
VESD[kV]@ISO 10605 | ±30 | ±30 | ±20 |
VRWM(最大值)[V] | 12 | 24 | 28 |
Ct(典型值/最大值)[pF] | 9/10 | 6.5/8 | |
RDYN(典型值)[Ω] | 0.8 | 1.1 | 1.5 |
* S-TOGL™ and L-TOGL™ are trademarks of Toshiba Electronic Devices & Storage Corporation.
* All other company names, product names, and service names may be trademarks of their respective companies.