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Downloadable
technical information
●Datasheet
●Application note
●Sample software for evaluation board
●Software programming manual

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Bluetooth®无线技术IC

Starting shipment two new ICs compliant with Bluetooth® Ver.5.0 from the end of January 2018

TC35680FSG, TC35681FSG

Toshiba Electronic Devices & Storage Corporation announced "TC35680FSG" with built-in Flash ROM and "TC35681FSG" with non built-in Flash ROM additions to its line-up of ICs compliant with the Bluetooth® low energy Sample shipments will start from the end of January 2018.
 

Bluetooth® wireless communication ICLong Communications RangeWide Temperature Range Ultra Low PowerHealthcareBeacons & TagsAutomotive

Bluetooth®经典/低能耗双型和Bluetooth® 低能耗(LE)器件被广泛应用于音频、移动、可穿戴式和医疗保健设备。不久的将来,Bluetooth经典/低能耗双型和Bluetooth®低能耗器件将实现越来越普遍的应用。十年多以来,东芝始终作为蓝牙技术联盟(SIG)(注1)的发起人和倡导者,致力于实现蓝牙解决方案的更广泛应用。东芝是蓝牙连接性IC和原始蓝牙协议和配置文件的主要来源。


(注1:SIG负责蓝牙标准的编制、蓝牙技术和制造商商标的许可)

Future Directions and Progress to Date as a Bluetooth SIG Promoter

BT-mesh_reference_en2

For parametric search, including download data sheets, functions and characteristics, please click here.


Bluetooth®标准和产品阵容

Bluetooth® low energy

bluetooth_low-energyTC35675XBGTC35676FSGTC35678FSGTC35678FXGTC35680FSGTC35670FTGTC35667FTGTC35679FSGTC35679IFTGTC35681FSGTC3567CFSGTC35667IFTGTC3567DFSG

Bluetooth® classic, classic / low energy dual

bluetooth_classicTC35661SBG-203TC35661IDBG-203TC35661IDBG-503TC35661SBG-503TC35661SBG-551TC35661IDBG-009TC35661SBG-009

*Bluetooth®是Bluetooth SIG, Inc.公司的注册商标。

*部份内容转自Bluetooth® SIG网站。

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【Content provided】
●Datasheet
●Hardware application note
●Software application note
●Sample software for IAR EWARM
●Sample software for MDK-ARM

●Software reference manual

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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.