MOSFET
东芝提供采用各种电路配置和封装的低VDSS和中／高VDSS MOSFET丰富组合，其特点是高速度、高性能、低损耗、低导通电阻、小封装等。
东芝在MOSFET的开发和制造方面拥有数十年的经验。其主要产品包括中高压DTMOS系列（VDSS为500V~800V）和低电压U-MOS系列（VDSS为12V~250V）。
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You can narrow down the search for applicable products by selecting specifications.
You can narrow down your search for applicable products by package type or number of pins.
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- SOT-1118 (UDFN6)
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Package Size
W : 2.0 mm 0.079 inch L : 2.0 mm 0.079 inch H : 0.75 mm 0.030 inch
- SOT-1220 (UDFN6B)
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Package Size
W : 2.0 mm 0.079 inch L : 2.0 mm 0.079 inch H : 0.75 mm 0.030 inch
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- DSOP Advance(WF)L
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Package Size
W : 5.0 mm 0.20 inch L : 6.0 mm 0.24 inch H : 0.76 mm 0.030 inch
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- DSOP Advance(WF)M
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Package Size
W : 5.0 mm 0.20 inch L : 6.0 mm 0.24 inch H : 0.76 mm 0.030 inch
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All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.
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About information presented in this cross reference
The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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