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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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丰富的封装系列产品

东芝负载开关IC包括一个输出晶体管和一个输出驱动IC电路,比传统的分立结构小得多。该封装系列主要针对1平方毫米级的超小型产品。特别是,该封装系列使得产品适用于需要节省空间的便携式设备。

unit:

All package dimensions are guaranteed in millimeters as mentioned on datasheet. Package dimension in inches is round to 2 significant digits converted with 1mm=0.0393701inch.

WCSP类型推荐用于小型和薄型移动和模块化设备。SMVs(SOT-25)也很受欢迎,它在消费类产品中易于操作。有关每个封装的产品系列,请参阅以上链接。这些封装在日本和泰国生产,质量高且稳定。

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